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  22-28-6043 Datasheet PDF File

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    HES75-199319 HES75-199319-8 HES75-200375-8 HES75-180416-8 HES75-200375 HES75-160430-8 HES75 HES75-120550 HES75-120550-8

HITRON ELECTRONICS CORPORTION
Part No. HES75-199319 HES75-199319-8 HES75-200375-8 HES75-180416-8 HES75-200375 HES75-160430-8 HES75 HES75-120550 HES75-120550-8 HES75-160430 HES75-170440 HES75-170440-8 HES75-180416 HES75-189389 HES75-189389-8 HES75-190390 HES75-190390-8
Description AC/DC EXTERNAL DESKTOP ADAPTER UNIVERSAL INPUT SINGLE OUTPUT 75 WATTS SWITCHING POWER SUPPLIES
File Size 285.27K  /  2 Page

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Amphenol Communications Solutions
Part No. 56604-302ALF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry,Double Row, Selective Loaded, 18 Position ,2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-T

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-TC/LA2 K4H560438E-TC/LAA K4H560838E K4H560438E-TLAA K4H560838E-TCAA K4H560838E-TLAA K4H560438E-TCAA K4H560438E-TCB3 K4H560438E-TLB3
Description DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片（了x4，x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
   DDR SDRAM 256Mb E-die (x4, x8)
File Size 216.51K  /  24 Page

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Amphenol Communications Solutions
Part No. 56604-302KLF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry,Double Row, Selective Loaded, 18 Position ,2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification
File Size 356.30K  /  24 Page

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Amphenol Communications Solutions
Part No. IC13416043
Description ASSY,LYNX QD,Right Angle Receptacle,40Position short no guide pin & COND. LOSSY
Tech specs 　 　

Official Product Page

    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -
File Size 180.64K  /  13 Page

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Amphenol Communications Solutions
Part No. 10136646-04322LF
Description Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Black Color, 4 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    1300060442 1300060426 1300060433 1300060440 1300060430 1300060422 1300060436

Molex Electronics Ltd.
Part No. 1300060442 1300060426 1300060433 1300060440 1300060430 1300060422 1300060436
Description MINI CHANGE ASSEMBLY 3-POLE FEMALE 90D
File Size 124.96K  /  1 Page

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Amphenol Communications Solutions
Part No. 10136646-043111LF
Description Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 4 Positions, GW Compatible, with out Posts, Tray packing.
Tech specs 　 　

Official Product Page

    K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3

Samsung semiconductor
Part No. K4H560438J-LC/LB0 K4H560438J-LC/LB3 K4H560838J-LC/LCC K4H561638J-LC/LB3 K4H561638J-LC/LCC K4H560838J-LC/LB3
Description 256Mb J-die DDR SDRAM Specification
File Size 352.76K  /  24 Page

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Amphenol Communications Solutions
Part No. RJE291660434
Description Modular Jack - 6P6C, Right Angle, Single Port, No Shield, Grey Housing, No Panel Stops
Tech specs 　 　

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规
File Size 194.54K  /  14 Page

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Amphenol Communications Solutions
Part No. 10136656-0432LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 4 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs 　 　

Official Product Page

    K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S561632E-UC75 K4S561632E-UL75 K4S561632E-UL60 K4S561632E-UC60 K4S560832E-UC75 K4S560832E-UL75 K4S560432E-UC K4S560432E-UC75 K4S560432E-UL75
Description 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片与内存规格4 TSOP-II免费（符合RoHS
File Size 196.27K  /  14 Page

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Amphenol Communications Solutions
Part No. 10136646-04312LF
Description Minitek® Pwr 4.2, Single Row, Right Angle Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 4 Positions, Non GW Compatible, with Posts, Tray packing.
Tech specs 　 　

Official Product Page

    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 196.59K  /  14 Page

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Amphenol Communications Solutions
Part No. 10137926-0434LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, 15u\\ Gold (Tin on Tails) plating, Natural Color, 4 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 SDRAM, LVTTL, 133MHz
256Mb E-die SDRAM Specification 54pin sTSOP-II
File Size 205.22K  /  14 Page

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