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Amphenol Communications Solutions |
Part No. |
69190-136HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
78290-136HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68690-136HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223302MFA
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223302M2A
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223306M2A
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223306MEA
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223304M2A
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
5962-9223304MEA
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90136-1132 0901361132
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Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni) 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
5962-9223302MEA
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Description |
1 OF 8 DECODER
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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