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				Hittite Microwave Corporation
Part No.	HMC560
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs MMIC FUNDAMENTAL MIXER, 24 - 40 GHz
File Size	258.28K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC562
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs PHEMT MMIC WIDEBAND DRIVER AMPLIFIER, 2 - 35 GHz
File Size	331.54K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC564
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 13.5 GHz
File Size	266.63K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC565
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	283.34K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC566 HMC565
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 29 - 36 GHz GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	287.26K / 6 Page	View it Online	Download Datasheet

				http:// Stanford Microdevices
Part No.	SNA-200
OCR Text	... area of the substrate. A 150 C cure for 1 hour is necessary. Recommended epoxy is Ablebond 84-1LMIT1 from Ablestik. 1. Set the heater block temperature to 260C +/- 10C. 2. Use pre-stressed (annealed) gold wire between 0.0005 to 0.001 inche...
Description	DC-6.5 GHz, Cascadable GaAs MMIC Amplifier
File Size	63.78K / 3 Page	View it Online	Download Datasheet

				M-Pulse
Part No.	MP16XX MP11XX MP12XX MP1300
OCR Text	... 1. Silver epoxy with a maximum cure temperature of 125C is recommended. O R S D I O D E S
Description	(MP1xxx) Tunnel Diodes
File Size	467.89K / 2 Page	View it Online	Download Datasheet

				White Electronic Designs Corporation
Part No.	WC16P332-16GI WC16P332-16GX WC16P332-16GC WC16P332-16GM
OCR Text	...KE PRE-BURN-IN ELECTRICAL cure EPOXY SEAM SEAL BURN-IN METHOD 1015 WIREBOND QUAL./DESTRUCT WIRE PULL, PER MIL-STD-883 METHOD 2011 POST BURN-IN ELECTRICAL MARK FINAL Q.A. METHOD 2009 WIREBOND TEMPERATURE CYCLE METHOD ...
Description	68332 MONOLITHIC MICROCONTROLLER
File Size	127.63K / 4 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XD1002
OCR Text	...n atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is preferred, then a fluxless...
Description	0.05-50.0 GHz GaAs MMIC Distributed Amplifier
File Size	333.24K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation 美国讯泰微波有限公司上海代表
Part No.	HMC322
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz GaAs MMIC SP8T NON-REFLECTIVE SWITCH/ DC - 10.0 GHz
File Size	175.07K / 6 Page	View it Online	Download Datasheet

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