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MIMIX[Mimix Broadband]
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| Part No. |
XX1002
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| OCR Text |
...on to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.
Absolute Maximum Ratings
Supply Voltage (Vcc) Supply C... |
| Description |
2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
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| File Size |
370.74K /
5 Page |
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it Online |
Download Datasheet
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TOSHIBA
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| Part No. |
TPH2R306NH
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| OCR Text |
...te 3: device mounted on a glass-epoxy board (a), figure 5.1 note 4: device mounted on a glass-epoxy board (b), figure 5.2 note 5: v dd = 48 v, t ch = 25 (initial), l = 0.097 mh, i ar = 60 a fig. fig. fig. fig. 5.1 5.1 5.1 5.1 devic... |
| Description |
Power MOSFET (N-ch single 30V<VDSS≤60V)
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| File Size |
236.40K /
9 Page |
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it Online |
Download Datasheet |
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ST Microelectronics
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| Part No. |
STTH2R02A STTH2R02U
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| OCR Text |
...ace under each lead - sma/smb (epoxy fr4, e cu = 35 m) figure 13. thermal resistance, junction to ambient, versus copper surface under each lead do-15 (epoxy fr4, e cu = 35 m) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;... |
| Description |
Ultrafast recovery diode
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| File Size |
116.22K /
9 Page |
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it Online |
Download Datasheet |
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Price and Availability
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