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  sputtered Datasheet PDF File

For sputtered Found Datasheets File :: 98    Search Time::1.39ms    
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    HTMS8201FTK HTMS8X01

NXP Semiconductors
Part No. HTMS8201FTK HTMS8X01
OCR Text ...5 ? m under bump metallization sputtered tiw htms1x01_8x01 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2014. all righ ts reserved. product data sheet company public rev. 3.3 ? 17 o...
Description HITAG transponder IC

File Size 464.09K  /  57 Page

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    FRN25J100R FRN25J2R2

Tyco Electronics
Part No. FRN25J100R FRN25J2R2
OCR Text sputtered onto a ceramic element. metal end caps are force fitted to the element prior to spiralling. tinned copper lead wires are welded to the end caps and the components are then coated with four layers of a flame- proof cement. all resi...
Description Flame-Proof Fusible Resistors

File Size 93.43K  /  3 Page

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    MRA0412 MRA0104 MRA0309

Ohmite Mfg. Co.
Part No. MRA0412 MRA0104 MRA0309
OCR Text ...sion resistor. stable flms are sputtered on to high purity alumina rods, then covered in tough epoxy to protect from any environmental extremes ? power dissipation up to 2w ? value range from r1 to 10m ? precision tolerance down to 0...
Description Power dissipation up to 2W
RoHS Compliant
   Power dissipation up to 2W

File Size 113.54K  /  2 Page

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    NXP
Part No. SL2ICS2001V1D
OCR Text ... m ? under bump metallization: sputtered tiw 3.6 fail die identification every die is electrically tested according to data sheet. identification of chips with electrical parameters not conform with the data sheet is done by inking and w...
Description I-CODE SLI Label IC bumped wafer specification on UV-tape

File Size 198.40K  /  9 Page

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    HTMS1001FTB HTMS1001FTK HTMS1001FUG HTMS1101FTB HTMS1101FTK HTMS1101FUG HTMS1201FTB HTMS1201FTK HTMS1201FUG HTMS8201FTK

NXP Semiconductors
Part No. HTMS1001FTB HTMS1001FTK HTMS1001FUG HTMS1101FTB HTMS1101FTK HTMS1101FUG HTMS1201FTB HTMS1201FTK HTMS1201FUG HTMS8201FTK HTMS8101FTK HTMS8101FTB HTMS8101FUG
OCR Text ... m ? under bump metallizat ion: sputtered tiw 8.1.6 fail die identification no inkdots are applied to the wafer. electronic wafer mapping (secs ii format) covers the electrical test results and additionally the results of mechanical/vis...
Description HITAG μ (ISO14223) and (ISO11784/85) Transponder IC

File Size 459.96K  /  57 Page

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    CT10-XXXX-G1

Coto Technology
Part No. CT10-XXXX-G1
OCR Text ...me and reliability - gold and sputtered ruthenium contact layers - tape and reel pack a ging sample applicat ions - note book computer covers - security system sensors - electric, gas metering - fluid flow sensor - level sen...
Description Ideal for SMD pick and place

File Size 115.77K  /  1 Page

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    A9213A

AMIC Technology
Part No. A9213A
OCR Text ... ? under bump metallization: sputtered tiw a9213-a iso/iec 14443a rfid tag ic rev 1.0 p 11 of 12 ver. 1.0 ...
Description ISO/IEC 14443A RFID TAG IC

File Size 108.88K  /  12 Page

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