| |
|
 |
Murata Manufacturing Co...
|
| Part No. |
GRM21A5C2J431GWA1
|
| OCR Text |
...erial : glass epoxy board ? thickness : 1.6mm ? thickness of copper foil : 0.035mm (1) test substrate b ? material : glass epoxy board ? thickness of copper foil : 0.035mm 2. test method of substrate bending test a) support state (b) ... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
976.12K /
28 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM21A5C2J431FWA1
|
| OCR Text |
...erial : glass epoxy board ? thickness : 1.6mm ? thickness of copper foil : 0.035mm (1) test substrate b ? material : glass epoxy board ? thickness of copper foil : 0.035mm 2. test method of substrate bending test a) support state (b) ... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
978.05K /
28 Page |
View
it Online |
Download Datasheet |
| |
|
|
Infineon Technologies A...
|
| Part No. |
PTFA091201E PTFA091201EV4R0 PTFA091201EV4R250 PTFA091201F
|
| OCR Text |
...ss otherwise specified: 1. lead thickness: 0.10 +0.051/?0.025 [.004 +.002/?.001]. 2. all tolerances 0.127 [.005] unless specified otherwise. 3. pins: d = drain, s = source, g = gate. 4. interpret dimensions and tolerances per asme y14.5m-1... |
| Description |
Thermally-Enhanced High Power RF LDMOS FETs
|
| File Size |
8,679.96K /
10 Page |
View
it Online |
Download Datasheet |
| |
|
|
Eaton All Rights Reserv...
|
| Part No. |
HC3-2R2-R HC3-3R3-R HC3-4R7-R HC3-5R6-R HC3-6R0-R
|
| OCR Text |
...urrents. pcb layout, trace thickness and width, air fow and proximity of other heat generating components will affect temperature rise. it is recommended that the temperature of the part not exceed 125c under worst case condi... |
| Description |
High current power inductors
|
| File Size |
259.69K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN1235
|
| OCR Text |
...ped packages with reduced size, thickness and weight in the form of the flip-chip. the electrical performance of such components in flip-chip are improved thanks to shorter connections than the ones in standard plastic packages (as tssop, s... |
| Description |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
| File Size |
85.46K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
Intersil
|
| Part No. |
ACTS244K
|
| OCR Text |
...tallization: type: alsi metal 1 thickness: 7.125k ? 1.125k ? metal 2 thickness: 9k ? 1k ? glassivation: type: sio 2 thickness: 8k ? 1k ? worst case current density: < 2.0 x 10 5 a/cm 2 bond pad size: 110 x 110 ( m m) 4.4 x 4.4 (mils) met... |
| Description |
Radiation Hardened Octal Non-Inverting Three-State Buffer
|
| File Size |
47.17K /
3 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
