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    NXP Semiconductors N.V.
Part No. LPC2132FBD64/CP325 LPC2134FBD64/0111 LPC2132FBD64/CP3252 LPC2132FBD64/01/S
OCR Text ... kb, 16 kb, and 32 kb, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-...thin quad ?at package; no leads; 64 terminals; body 9 9 0.85 mm sot804-2 lpc2132fhn64/01 hvqfn64 p...
Description 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64
Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC; Package: SOT314-2 (LQFP64); Container: Reel Pack, SMD, 13&quot; 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64

File Size 506.49K  /  44 Page

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    MIC5309-1.8YMT MIC5309-1.5YMT MIC5309-1.2YMT MIC5309-1.5YD6 MIC5309-1.2YD6 MIC5309-1.8YD6 MIC5309YD6 MIC5309YMT

Micrel Semiconductor
Part No. MIC5309-1.8YMT MIC5309-1.5YMT MIC5309-1.2YMT MIC5309-1.5YD6 MIC5309-1.2YD6 MIC5309-1.8YD6 MIC5309YD6 MIC5309YMT
OCR Text ...ating current while maintaining very fast transient response. The MIC5309 can source up to 300mA of output current and can regulate down fro...thin MLF(R) leadless package as well as the 6-pin TSOT-23 for cost sensitive applications. Data shee...
Description Low VIN/VOUT 300mA High PSRR ULDO?/a> with Ultra-Low IQ
Low VIN/VOUT 300mA High PSRR ULDO⑩ with Ultra-Low IQ

File Size 345.98K  /  11 Page

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    HTMS8201FTK HTMS8X01

NXP Semiconductors
Part No. HTMS8201FTK HTMS8X01
OCR Text ...hvson2 plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 ? 2 ? 0.85 mm hitag ? , 210 pf sot899-1 htms1101ftk/af hvson2 plastic thermal enhanced very thin small outline package; no leads; 2 termi...
Description HITAG transponder IC

File Size 464.09K  /  57 Page

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    NXP Semiconductors N.V.
Part No. LPC1311FHN33 LPC1311FHN33-01 LPC131111 LPC1313FBD48-01 LPC1313FHN33-01 LPC1342FBD48
OCR Text ...qfn33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 ? 7 ? 0.85 mm n/a lpc1311fhn33/01 hvqfn33 hvqfn33: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 ? 7...
Description Cortex-M3 with 8 kB flash, 4 kB SRAM, upto 72 MHz performance and on-chip power profiles
32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device

File Size 1,185.45K  /  73 Page

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    Vishay Intertechnology
Part No. CHP2010 CHP1505 CHP1206 CHP0505 CHP0502
OCR Text ... specially designed to meet very stringent specifications in terms of reliability, stability, homogeneity, reproductibility an...thin film terminations, with nickel barrier, are very convenient for high temperature operating con...
Description (CHP Series) High Stability Resistor Chips

File Size 214.14K  /  4 Page

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    ADC1412D065 ADC1412D080

NXP Semiconductors
Part No. ADC1412D065 ADC1412D080
OCR Text ...VQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm HVQFN64 plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm HVQFN64 plastic thermal enh...
Description (ADC1412D065 - ADC1412D125) Dual 14-bit ADC

File Size 324.07K  /  37 Page

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    NXP Semiconductors N.V.
Part No. LPC11A11FHN33 LPC11A14FHN33 LPC11A12FHN33
OCR Text ...( 5 ? 5 ) packages, and in a very small wlcsp20 package. 3. applications 4. ordering information ? power management ? gaming equipmen...thin quad flat package; no leads; 33 terminals; body 7 ? 7 ? 0.85 mm n/a lpc11a12fhn33/101 hvqf...
Description 32-bit ARM Cortex-M0 microcontroller??kB flash, 2kB SRAM, HVQFN32 package
32-bit ARM Cortex-M0 microcontroller??2kB flash, 8kB SRAM, HVQFN32 package
32-bit ARM Cortex-M0 microcontroller??6kB flash, 4kB SRAM, HVQFN32 package

File Size 1,824.47K  /  84 Page

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    Agilent Technologies, Inc.
Part No. HMPP-3893-BLK
OCR Text ... 4 1 2 3 4 1 3 4 1 2 figure 13. very high isolation spdt switch, dual bias. typical applications rf common rf 1 1 2 3 4 bias 1 rf 2 bias 2 r...thin i layer is grown. after the epitaxial growth, difusion is used to add a heavily doped (n or ...
Description 100 V, SILICON, PIN DIODE LEADLESS, ULTRA MINI, QFN, MINIPAK-4

File Size 482.87K  /  13 Page

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    LPC11U12FBD48.201 LPC11U12FHN33.201 LPC11U13FBD48.201 LPC11U14FBD48.201 LPC11U14FHI33.201 LPC11U14FET48.201 LPC11U14FHN3

NXP Semiconductors
Part No. LPC11U12FBD48.201 LPC11U12FHN33.201 LPC11U13FBD48.201 LPC11U14FBD48.201 LPC11U14FHI33.201 LPC11U14FET48.201 LPC11U14FHN33.201
OCR Text ...vqfn33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 ? 7 ? 0.85 mm n/a lpc11u12fbd48/201 lqfp48 plastic low prof ile quad flat package; 48 leads; body 7 ? 7 ? 1.4 mm sot313-2 lpc11u13fbd48/201...
Description 32-bit ARM Cortex-M0 microcontroller; up to 32 kB flash; 6 kB SRAM; USB device; USART

File Size 1,472.11K  /  69 Page

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    LPC2131 LPC2131FBD64 LPC2131FBD64_01 LPC2132 LPC2132FBD64 LPC2132FBD64_01 LPC2132FHN64 LPC2132FHN64_01 LPC2134 LPC2134FB

NXP Semiconductors
Part No. LPC2131 LPC2131FBD64 LPC2131FBD64_01 LPC2132 LPC2132FBD64 LPC2132FBD64_01 LPC2132FHN64 LPC2132FHN64_01 LPC2134 LPC2134FBD64 LPC2134FBD64_01 LPC2136 LPC2138
OCR Text ... kB, 16 kB, and 32 kB, they are very well suited for communication gateways and protocol converters, soft modems, voice recognition and low-...thin quad flat package; no leads; 64 terminals; body 9 x 9 x 0.85 mm LPC2132FHN64/01 HVQFN64 plas...
Description Single-chip 16/32-bit microcontrollers; 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC

File Size 174.30K  /  39 Page

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DS10G-COMBO-EVERYTHING
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Tempo Communications Inc Everything Kit G2 - 1/10G Eth/Ds1/Ds3/Tims - Ds-C-E2-3-K2 |Tempo Communications DS10G-COMBO-EVERYTHING 25: USD19880.91
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