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  dramc-die Datasheet PDF File

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    11-40-2064 1140-2064 0011-40-2064

Molex Electronics Ltd.
Part No. 11-40-2064 1140-2064 0011-40-2064
Description Terminator Die

File Size 19.42K  /  1 Page

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    11-40-2042 1140-2042 0011-40-2042

Molex Electronics Ltd.
Part No. 11-40-2042 1140-2042 0011-40-2042
Description Terminator Die

File Size 19.91K  /  1 Page

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    11-40-2015 1140-2015 0011-40-2015 001140-2015

Molex Electronics Ltd.
Part No. 11-40-2015 1140-2015 0011-40-2015 001140-2015
Description Terminator Die

File Size 19.96K  /  1 Page

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    11-40-2001 0011402001 T8300A 1140-2001 0011-40-2001 001140-2001

Molex Electronics Ltd.
Part No. 11-40-2001 0011402001 T8300A 1140-2001 0011-40-2001 001140-2001
Description Terminator Die

File Size 22.38K  /  3 Page

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    11-40-2004 T8302A 1140-2004 0011-40-2004 001140-2004 0011402004

Molex Electronics Ltd.
Part No. 11-40-2004 T8302A 1140-2004 0011-40-2004 001140-2004 0011402004
Description Terminator Die

File Size 21.43K  /  2 Page

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    Analog Devices, Inc.
Part No. OP-08G OP-08GR
Description OP-AMP, 300 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, UUC7 DIE
OP-AMP, 1000 uV OFFSET-MAX, 0.8 MHz BAND WIDTH, UUC7 DIE

File Size 211.13K  /  7 Page

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    http://
IXYS[IXYS Corporation]
IXYS, Corp.
Part No. IXFN26N90 IXFN25N90 IXFN-26N90 IXFN-25N90
Description Discrete MOSFETs: HiPerFET Power MOSFETS
HiPerFETTM Power MOSFETs Single Die MOSFET
HiPerFET Power MOSFETs Single Die MOSFET 25 A, 900 V, 0.33 ohm, N-CHANNEL, Si, POWER, MOSFET

File Size 140.57K  /  4 Page

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    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
Description (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V
(32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V

File Size 256.70K  /  14 Page

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    Analog Devices, Inc.
Part No. OP-04N OP-14G OP-14N OP-14Z/883
Description DUAL OP-AMP, 750 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, UUC14 DIE-14
DUAL OP-AMP, 2000 uV OFFSET-MAX, UUC14 DIE-14
DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, CDIP8 HERMETIC SEALED, CERAMIC, DIP-8

File Size 814.27K  /  8 Page

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    Samsung Electronics
Part No. KFG1G16Q2C
Description 1Gb OneNAND C-die

File Size 1,255.08K  /  142 Page

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