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Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
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Part No. |
MR18R326GAG0-CT9 MR18R326GAG0-CM8 MR18R326GAG0
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Description |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V 2Mx186个RIMM的模块基76Mb阿芯片,32秒银行,32K/32ms参考,.5V (32Mx18) 16pcs RIMM Module based on 576Mb A-die 32s banks32K/32ms Ref 2.5V
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File Size |
256.70K /
14 Page |
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it Online |
Download Datasheet |
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Analog Devices, Inc.
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Part No. |
OP-04N OP-14G OP-14N OP-14Z/883
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Description |
DUAL OP-AMP, 750 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, UUC14 DIE-14 DUAL OP-AMP, 2000 uV OFFSET-MAX, UUC14 DIE-14 DUAL OP-AMP, 3000 uV OFFSET-MAX, 1.3 MHz BAND WIDTH, CDIP8 HERMETIC SEALED, CERAMIC, DIP-8
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File Size |
814.27K /
8 Page |
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it Online |
Download Datasheet |
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Price and Availability
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