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  hollow-emitter Datasheet PDF File

For hollow-emitter Found Datasheets File :: 152    Search Time::0.844ms    
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    BLW29

NXP Semiconductors
Philips Semiconductors
Part No. BLW29
OCR Text ...onnections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. August 1986 7 Philips Semiconductors Product specification VHF power transi...
Description VHF power transistor

File Size 65.07K  /  11 Page

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    BLT50

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLT50
OCR Text ...made by means of fixing screws, hollow rivets and copper foil straps, as shown. Fig.7 Component layout for 470 MHz class-B test circuit. April 1991 7 Philips Semiconductors Product specification UHF power transistor BLT...
Description UHF power transistor

File Size 70.24K  /  10 Page

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    BLT53

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLT53
OCR Text ...ound plane are made by means of hollow rivets. Dimensions in mm. Fig.10 Component layout for 470 MHz class-B test circuit. May 1991 8 Philips Semiconductors Product specification UHF power transistor BLT53 MCD199 ...
Description UHF power transistor

File Size 72.08K  /  11 Page

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    BLU99_SL BLU99 BLU99/SL BLU99SL

PHILIPS[Philips Semiconductors]
NXP Semiconductors
Part No. BLU99_SL BLU99 BLU99/SL BLU99SL
OCR Text .... Earth connections are made by hollow rivets. Fig.9 Printed circuit board and component layout for 470 MHz. March 1993 7 Philip...emitter class-B circuit) at f = 900 MHz; Th = 25 C MODE OF OPERATION narrow band; c.w. VCE V 12,5 PL...
Description UHF power transistor

File Size 110.82K  /  17 Page

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    BLV103

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLV103
OCR Text ...made by means of fixing screws, hollow rivets and copper straps around the board and under the emitters, to provide a direct contact between the components side and the ground plane. Fig.9 Component layout for 960 MHz class-AB test circu...
Description UHF power transistor

File Size 89.90K  /  10 Page

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    PHILIPS[Philips Semiconductors]
Part No. BLV33F
OCR Text .... Earth connections are made by hollow rivets. Additionally copper straps are used under the emitters and at the input and output to provide direct contact between the copper on the component side and the ground-plane. Fig.10 Component l...
Description VHF linear power transistor

File Size 148.63K  /  20 Page

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    PHILIPS[Philips Semiconductors]
Part No. BLV59
OCR Text ...ions are made by fixing screws, hollow rivets and copper straps around the board and under the bases to provide a direct contact between the copper on the component side and the ground plane. Fig.7 Printed-circuit board and component lay...
Description UHF linear power transistor

File Size 103.99K  /  12 Page

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    BLW85

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BLW85
OCR Text ...onnections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. To minimize the dielectric losses, the ground plane under the interconnection of L7 and C7...
Description HF/VHF power transistor

File Size 108.93K  /  15 Page

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    STMICROELECTRONICS[STMicroelectronics]
Part No. BU508DFI
OCR Text ...ive high performance and uses a Hollow Emitter structure to enhance switching speeds. 3 2 3 2 TO-218 1 ISOWATT218 1 INTERNAL SCHEMATIC DIAGRAM For TO-3 : C = Tab E = Pin2. ABSOLUTE MAXIMUM RATINGS Symbol V CES V CE...
Description    HIGH VOLTAGE FAST-SWITCHING NPN POWER TRANSISTORS

File Size 80.69K  /  8 Page

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