| |
|
 |
hitachi
|
| Part No. |
HRW0502A
|
| OCR Text |
...r high effifiency rectifying. * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 ** 10msec half sine wave 1 pulse
Symbol VRRM* Io* IFSM** Tj Tstg
Value 20 500 5 125 -55 to +... |
| Description |
From old datasheet system
|
| File Size |
30.60K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
hitachi
|
| Part No. |
HSM198S
|
| OCR Text |
...signed for balanced mixer use * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 -- -- 70 30 Typ -- -- -- -- -- -- -- Max 1.1 70 -- 1.5 10 -- -- Unit V A mA pF mV % V Test Conditi... |
| Description |
From old datasheet system
|
| File Size |
28.28K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
Motorola
|
| Part No. |
MPXM2202
|
| OCR Text |
...mV FULL SCALE SPAN (TYPICAL)
MPAK PACKAGE
SCALE 1:1 CASE 1320
SCALE 1:1 CASE 1320A
X-ducer SENSING ELEMENT
2 4
Vout+
PI...5) MPXM2202D/G Series MPXM2202A Series Span(3) MPXM2202D/G Series MPXM2202A Series Symbol POP VS Io ... |
| Description |
200 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
From old datasheet system
200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors
|
| File Size |
87.39K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
hitachi
|
| Part No. |
HRW0302A
|
| OCR Text |
...r high effifiency rectifying. * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 ** Square waave, Duty (1/2) *** 10msec half sine wave 1 pulse
Symbol VRRM * I o *,** IFSM *** T... |
| Description |
From old datasheet system
|
| File Size |
30.78K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
hitachi
|
| Part No. |
HSM2693A
|
| OCR Text |
...w capacitance. (C =1.2pF max) * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 Capacitance C (pF)
-4
1.0
1.0
0.5
0
10
10-3 Forward current I F (A) Fig.1 Forwa... |
| Description |
From old datasheet system
|
| File Size |
26.66K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
hitachi
|
| Part No. |
HSM83
|
| OCR Text |
...gh reverse voltage. (VR=250V) * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 --
Max 1.2 0.2 100 3.0 100
Unit V A pF ns
Test Condition IF = 100 mA VR = 250 V VR = 300 ... |
| Description |
From old datasheet system
|
| File Size |
27.88K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
hitachi
|
| Part No. |
HSM2692
|
| OCR Text |
...w capacitance. (C =1.2pF max) * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 Capacitance C (pF)
-4
1.0
1.0
0.5
0
10
10-3 Forward current I F (A) Fig.1 Forwa... |
| Description |
From old datasheet system
|
| File Size |
23.62K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
hitachi
|
| Part No. |
HSM112WK
|
| OCR Text |
...backup battery automatically. * MPAK package is suitable for high density surface mounting and high speed assembly.
2
Pin Arrangement
3...5 -- -- Typ -- -- -- -- Max 0.3 0.8 30 A 0.1 VR = 5 V Unit V Test Condition IF = 1 mA
HSM112WK
1... |
| Description |
From old datasheet system
|
| File Size |
24.16K /
3 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
