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package-glass Datasheet PDF File

For package-glass Found Datasheets File :: 22120 Search Time::3.75ms
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				MOTOROLA[Motorola, Inc]
Part No.	MMBF0201 MMBF0201N
OCR Text	... Miniature SOT-23 Surface Mount Package Saves Board Space MMBF0201N Motorola Preferred Device N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET ...glass epoxy board using minimum recommended footprint. ORDERING INFORMATION Device MMBF0201NLT1 ...
Description	N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
File Size	178.83K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MMBF0202PLT1 MMBF0202PL ON2091
OCR Text	... Miniature SOT-23 Surface Mount Package Saves Board Space 1 GATE 2 SOURCE MMBF0202PLT1 Motorola Preferred Device P-CHANNEL ENHANCEME...glass epoxy board using minimum recommended footprint. ORDERING INFORMATION Device MMBF0202PLT1 ...
Description	From old datasheet system P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
File Size	190.27K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] ONSEMI[ON Semiconductor]
Part No.	MMBF4391LT1 MMBF4392L MMBF4392LT1 MMBF4393LT1 ON2098
OCR Text	... USING THE SOT-23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a cri...glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other ...
Description	From old datasheet system CASE 3188, STYLE 10 SOT3 (TO?36AB JFET Switching Transistors
File Size	137.40K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MMBTH10LT1
OCR Text	... USING THE SOT-23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a cri...glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other ...
Description	VHF/UHF Transistor
File Size	86.76K / 6 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	MMQA5V6T1 MMQA20VT1 ON2242
OCR Text	...r separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: *...glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other ...
Description	SC-59 QUAD TRANSIENT VOLTAGE SUPPRESSOR 5.6 VOLTS 24 W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE From old datasheet system
File Size	136.87K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola, Inc. MOTOROLA[Motorola Inc] ONSEMI[ON Semiconductor]
Part No.	MSB709RT1 MSB709-RT1 ON2370
OCR Text	...rface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow proce...glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternat...
Description	PNP General Purpose Amplifier Transistor Surface Mount 100 mA, 25 V, PNP, Si, SMALL SIGNAL TRANSISTOR From old datasheet system
File Size	111.84K / 4 Page	View it Online	Download Datasheet

				http:// NEC[NEC] NEC Corp. NEC, Corp.
Part No.	NNCD5.1C NNCD5.6C NNCD6.2C NNCD6.8C NNCD4.3C NNCD4.7C NNCD7.5C NNCD3.3C NNCD3.6C NNCD9.1C NNCD8.2C NNCD10C NNCD11C NNCD12C NNCD3.9C
OCR Text	...into 2PIN Ultra Super Mini Mold Package having allowable power dissipation of 150 mW. PACKAGE DIMENSIONS (in millimeters) 2.1 0.1 1.3 ...Glass Epoxy) 50 0 0 50 100 150 200 TA - Ambient Temperature - C Fig. 2 IT...
Description	ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES 150 mW TYPE 静电放电二极管噪声裁剪式150毫瓦
File Size	40.20K / 8 Page	View it Online	Download Datasheet

				http:// NEC[NEC] NEC Corp. NEC, Corp.
Part No.	NNCD5.1D NNCD5.6D NNCD6.2D NNCD6.8D NNCD4.3D NNCD4.7D NNCD7.5D NNCD3.3D NNCD3.6D NNCD9.1D NNCD8.2D NNCD10D NNCD11D NNCD12D NNCD3.9D
OCR Text	...s are into 2PIN Super Mini Mold Package having allowable power dissipation of 200 mW. PACKAGE DIMENSIONS (in millimeters) 2.5 0.15 1.7...Glass Epoxy) 150 100 50 0 0 25 50 75 100 125 150 TA - Ambient Tempe...
Description	ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES 200 mW TYPE 静电放电二极管噪声裁剪式200毫瓦
File Size	39.87K / 8 Page	View it Online	Download Datasheet

				NEC[NEC] NEC Corp. NEC, Corp.
Part No.	NNCD5.6MG NNCD6.2MG NNCD6.8MG NNCD6.2MG-T1 NNCD6.2MG-T2 NNCD5.6MG-T2 NNCD6.8MG-T2 NNCD5.6MG-T1 NNCD6.8MG-T1
OCR Text	... mounted in the 5-PIN Mini Mold Package, that product can cope with high density assembling. 2.9 0.2 0.95 PACKAGE DIMENSIONS (in millim...Glass Epoxy) 150 100 m NNCD5.6MG NNCD6.2MG NNCD6.8MG 100 50 IT - On State Current - A...
Description	ESD noise clipping diode 5pin SC-74A Low capacitance,Hi ESD type LOW CAPACITANCE HIGH ESD TYPE ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODES QUARTO TYPE: COMMON ANODE 5-PIN MINI MOLD 低电容高ESD静电放电噪音型裁剪二极管季刊类型：共阳极5针迷你模
File Size	31.34K / 4 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCF8576C PCF8576CH PCF8576CT PCF8576CU PCF8576CU_10 PCF8576CU_12 PCF8576CU_5 PCF8576CU_7 PCF8576 PCF8576CU_2
OCR Text	...gle plane BONDING PAD LOCATIONS PACKAGE OUTLINES SOLDERING Introduction Reflow soldering Wave soldering LQFP VSO Method (LQFP and VSO) Repai...glass technology * Manufactured in silicon gate CMOS process. 2 GENERAL DESCRIPTION The PCF8576C ...
Description	Universal LCD driver for low multiplex rates
File Size	264.72K / 44 Page	View it Online	Download Datasheet

For package-glass Found Datasheets File :: 22120 Search Time::3.75ms
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