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Coilcraft Inc |
| Part No. |
EPL6024-681MEB
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| Description |
General Purpose Inductor, 0.68uH, 20%, Ferrite-Core, 2524
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702463002 70246-3002
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
 View
it Online |
Download Datasheet
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Coilcraft Inc |
| Part No. |
EPL6024-681MEC
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| Description |
General Purpose Inductor, 0.68uH, 20%, Ferrite-Core, 2524
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702463004 70246-3004
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
| Part No. |
EPL6024-681
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| Description |
Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702462001 70246-2001
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Coilcraft Inc |
| Part No. |
EPL6024-681ME
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| Description |
Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702462002 70246-2002
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87024-610TRLF
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| Description |
Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 20 Positions, Locator Mounting style.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702462004 70246-2004
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 20Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating
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| File Size |
176.00K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
87024-630TRLF
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| Description |
Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 60 Positions, Locator Mounting style.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702463001 70246-3001
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-102-46LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70246-4402 0702464402 70246-6402
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 44Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
175.94K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
98401-802-46LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87024-650
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| Description |
Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 100 Positions, Locator Mounting style.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68602-462HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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