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				MIMIX[Mimix Broadband]
Part No.	XQ1003-BD XQ1003-BD-EV1 XQ1003-BD-000V
OCR Text	...n atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "E...
Description	6.8-7.9 GHz GaAs MMIC Voltage Controlled Oscillator
File Size	193.83K / 5 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XQ1004-BD-EV1 XQ1004-BD-000V XQ1004-BD
OCR Text	...n atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "E...
Description	7.4-8.6 GHz GaAs MMIC Voltage Controlled Oscillator
File Size	191.46K / 5 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XQ1006-BD-EV1 XQ1006-BD-000V XQ1006-BD
OCR Text	...n atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "E...
Description	14.7-15.7 GHz GaAs MMIC Voltage Controlled Oscillator
File Size	388.44K / 5 Page	View it Online	Download Datasheet

				??『绉???′唤?????? 友顺科技股份有限公司 UTC[Unisonic Technologies]
Part No.	F6908-S08-R F6908-S08-T F6908L-S08-R F6908L-S08-T F6908
OCR Text	...-016.B F6908 POWER DERATING cure PD (mW) 1000 LINEAR INTEGRATED CIRCUIT 800 687 600 400 200 0 25 50 75 85 100 125 150 Ta () To use at temperature above Ta=25 reduce 5.5mW/ (On 70.0mmx70.0mmx1.6...
Description	SINGLE-PHASE FULL-WAVE MOTOR DRIVER FOR FAN MOTOR
File Size	196.63K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC392
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GaAs MMIC LOW NOISE AMPLIFIER, 3.5 - 7.0 GHz
File Size	225.43K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC395
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4.0 GHz
File Size	197.46K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC396
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 8.0 GHz
File Size	212.33K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC397
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 10.0 GHz
File Size	211.61K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC424
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball...
Description	0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR/ DC - 13 GHz 0.5dB LSB GaAs MMIC 6-BIT DIGITAL ATTENUATOR, DC - 13 GHz
File Size	210.28K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC425
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball...
Description	0.5 dB LSB GaAs MMIC 6-BIT DIGITAL POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz
File Size	201.16K / 6 Page	View it Online	Download Datasheet

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