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    CP382X

Central Semiconductor Corp
Part No. CP382X
OCR Text process cp382x small signal transistor npn - low v ce(sat) transistor chip process details die size 26 x 26 mils die thickness 5.9 mils base bonding pad area 5.5 x 5.5 mils emitter bonding pad area 5.5 x 5.5 mils top sid...
Description Small Signal Transistor NPN - Low VCE(SAT) Transistor Chip

File Size 727.03K  /  2 Page

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    CAT5138 CAT5137 CAT5136

ON Semiconductor
Part No. CAT5138 CAT5137 CAT5136
OCR Text ...initially and after a design or process change that affects the parameter. 3. integral non-linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. 4. di...
Description Digital Potentiometers (POTs) with 128 Taps and I2C Interface

File Size 165.76K  /  11 Page

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    CAT5132

ON Semiconductor
Part No. CAT5132
OCR Text ...initially and after a design or process change that affects the parameter. 6. absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used as a potentiometer. 7. relativ...
Description 16 Volt Digital Potentiometer (POT) with 128 Taps and I2C Interface

File Size 175.58K  /  12 Page

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    WPC

List of Unclassifed Manufacturers
List of Unclassifed Man...
Part No. WPC
OCR Text process information and data (?information?) in this document is an outline only , for general information purposes ; it doe s not constitute a representation or warranty as to capability , performance or suitability of the process fo...
Description Bipolar process

File Size 44.83K  /  1 Page

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    Tyco
Part No. TPB11CGVRA TPB11FGRA TPBF11FGRA TPB21RGPC TPB11FGVRA
OCR Text ...tches, tiny, part number matrix process seal version not process seal version available f = flush actuator* g = gold none = silver** blank=wire lug pc=printed circuitra=right angle*** vra=vertical right angle**** 0=black 2=red blank= sq. n...
Description TP Series Pushbutton Switches

File Size 473.87K  /  7 Page

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    SMV1812MXXXKRR

Ceramate Technical
Part No. SMV1812MXXXKRR
OCR Text ...ing and gradual cooling process is suggested. ir soldering has the highest yields due to controlled heating rates and solder liquids times. make sure that the element is not 2 .4 the ...
Description Zinc Oxide

File Size 269.86K  /  9 Page

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    SMLD12HBC7W1

Rohm
Part No. SMLD12HBC7W1
OCR Text .... (see fig-2) number of reflow process shall be max 2 times and these processes shall be performed in a row. cooling process to normal te mperature shall be required between the first and the s econd soldering process. 3. handling ...
Description Surface Mount Chip LED

File Size 171.77K  /  7 Page

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