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For sawn Found Datasheets File :: 646 Search Time::0.875ms
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				INFINEON[Infineon Technologies AG]
Part No.	SIGC25T120C C67078-A4674-A001
OCR Text	...Size 5.71 x 4.53 mm2 Package sawn on foil Ordering Code C67078-A4674A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivati...
Description	IGBT Chip in NPT-technology
File Size	62.29K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SIGC42T120CS Q67050-A4048-A001
OCR Text	...Size 6.59 x 6.49 mm2 Package sawn on foil Ordering Code Q67050A4048-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivati...
Description	IGBT Chip in NPT-technology
File Size	64.11K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SIGC42T120C Q67041-A4724-A001
OCR Text	...Size 6.59 x 6.49 mm2 Package sawn on foil Ordering Code Q67041A4724-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivati...
Description	IGBT Chip in NPT-technology
File Size	64.08K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	SIGC42T170R2C Q67050-A4117-A003
OCR Text	...Size 6.51 x 6.51 mm2 Package sawn on foil Ordering Code Q67050-A4117A003 MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivati...
Description	IGBT Chip in NPT-technology
File Size	67.33K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SIGC81T120R2C Q67041-A4701-A003
OCR Text	...Size 9.08 X 8.98 mm2 Package sawn on foil Ordering Code Q67041A4701-A003 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivati...
Description	IGBT Chip in NPT-technology
File Size	66.35K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	Q67050-A4127-A001 SIDC56D120E6
OCR Text	...e Size 7.5 x 7.5 mm2 Package sawn on foil Ordering Code Q67050-A4127A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside An...
Description	Fast switching diode chip in EMCON-Technology
File Size	63.47K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	Q67050-A4101-A102 SIDC81D120H6
OCR Text	... Die Size 9 x 9 mm2 Package sawn on foil Ordering Code Q67050-A4101A102 1200V 150A MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivatio...
Description	Fast switching diode chip in EMCON-Technology
File Size	62.56K / 4 Page	View it Online	Download Datasheet

				Infineon Technologies AG
Part No.	IDC08S60C
OCR Text	...ize 1.658 x 1.52 mm2 Package sawn on foil MECHANICAL PARAMETER: Raster size Anode pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metalization Cathode metalizat...
Description	2nd generation thinQ SiC Schottky Diode 2nd generation thinQ! SiC Schottky Diode
File Size	55.27K / 4 Page	View it Online	Download Datasheet

				MAS Micro Analog systems
Part No.	MAS6720A1TG00 MAS6720
OCR Text	...ctual left bottom corner of the sawn chip. Note2: See coordinates in pin description. Note3: Die dimensions include 80 m scribes for both sides. 3 (4) DA6720.000 2 January 2007 ORDERING INFORMATION Product Code MAS6720A1TG00 Outpu...
Description	IC FOR 32.768 kHz XO
File Size	46.26K / 4 Page	View it Online	Download Datasheet

				Micro Analog systems
Part No.	MAS9270 MAS9270C2SN06 MAS9270C3SN06 MAS9270CASN06 MAS9270CTB1 MAS9270CTB2 MAS9270CTB3 MAS9270CTG1 MAS9270CTG2 MAS9270CTG3
OCR Text	...ctual left bottom corner of the sawn chip. 3 (9) DA9270.008 11 September 2006 SAMPLES IN SB20 DIL PACKAGE 1 2 3 20 OUT 19 18 GND 17 MAS9270 YYWW XXXXX.X TE2 4 TE1 5 DA 6 CLK 7 PV 8 VDD 9 10 16 X2 15 14 X1 13 12 VC 11 ...
Description	IC FOR 10.00 - 30.00 MHz VCTCXO
File Size	126.24K / 9 Page	View it Online	Download Datasheet

For sawn Found Datasheets File :: 646 Search Time::0.875ms
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