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				Hittite Microwave Corpo... Hittite Microwave Corporation
Part No.	HMC330
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 93 Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force o...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 25 - 40 GHz
File Size	162.69K / 6 Page	View it Online	Download Datasheet

				MURATA
Part No.	CDALA10M7GA034V
OCR Text	...ions such as material of resin, cure temperature, and so on should be evaluated well. 9. Do not use strong acidity flux, more than 0.2wt% chlorine content, in re-flow soldering. 10. Accurate test circuit values are required to measure elect...
Description	Ceramic Filters (CERAFIL) for FM Receivers
File Size	925.85K / 58 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	14OSC0501
OCR Text	...n atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is preferred, then a fluxless...
Description	14.2-15.2 GHz GaAs MMIC Voltage Controlled Oscillator
File Size	205.89K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC260
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 49 Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force o...
Description	GaAs MMIC FUNDAMENTAL MIXER, 14 - 26 GHz
File Size	177.44K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC262
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball...
Description	GaAs MMIC LOW NOISE AMPLIFIER 15 - 24 GHz
File Size	118.85K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC263
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire (DC Bias) or ribbon bond (RF ports) 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is ...
Description	GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz
File Size	209.77K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC266
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 69 Wire Bonding Ribbon bond with 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size recommended. Thermosonic wirebonding with a nominal stage t...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz
File Size	166.07K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC283
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire (DC Bias) or ribbon bond (RF ports) 0.076 mm x 0.013 mm (3 mil x 0.5 mil) size is ...
Description	GaAs MMIC MEDIUM POWER AMPLIFIER, 17 - 40 GHz
File Size	281.59K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC570
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q DOWNCONVERTER 17 - 21 GHz
File Size	305.56K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC578
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHZ OUTPUT
File Size	242.95K / 6 Page	View it Online	Download Datasheet

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