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				Hittite Microwave Corporation
Part No.	HMC576
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GAAS MMIC X2 ACTIVE FREQUENCY MULTIPLIER, 18 - 29 GHZ OUTPUT
File Size	253.25K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC486
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GAAS PHEMT MMIC 2 WATT POWER AMPLIFIER, 7.0 - 9.0 GHZ
File Size	335.04K / 8 Page	View it Online	Download Datasheet

				http:// Tyco Electronics
Part No.	MA4GP907 MA4GP907-T MA4GP907-W
OCR Text	...cturer's schedule. For extended cure times > 30 minutes, temperatures must be below 200 C. Sn Rich Solders are not recommended due to the Tungsten Metallization scheme beneath the gold contacts. Indalloy or 80 Au/20 Sn Solders are acceptabl...
Description	GaAs Flip-Chip PIN Diodes
File Size	146.53K / 4 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MASW-004100 MASW-004100-11930W
OCR Text	...nt to ensure complete coverage. cure epoxy per manufacturer's schedule. 2 Typical Microwave Performance MASW-004100-1193 INSERTION LOSS 0.0 Loss (dB) -0.5 -1.0 -1.5 -2.0 0.0 5.0 10.0 15.0 Frequency (GHz) 20.0 25.0 30.0 J1-J2 J1-J...
Description	Monolithic PIN SP4T Diode Switch
File Size	184.32K / 6 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MASW-005100 MASW-005100-1194 MASW-005100-1194W
OCR Text	...nt to ensure complete coverage. cure epoxy per manufacturer's recommended schedule. 5 SP5T Monolithic Pin Diode Switch MASW-005100-1194 Rev 1 Operation of the MASW-005100-1194 Switch The simultaneous application of negative DC...
Description	Monolithic PIN SP5T Diode Switch
File Size	783.91K / 7 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MASW6020G
OCR Text	...d the perimeter of the chip. C. cure epoxy per manufacturer's recommended schedule. Bond Pad Dimensions - Inches (mm) RF1, RF2: Alt RF: A,B: GND1: GND2 : Term: 0.004 x 0.006 (0.100 x 0.150) 0.004 x 0.005 (0.100 x 0.125) 0.004 x 0.004 (0...
Description	GaAs SPST Switch DC-6 GHz
File Size	103.50K / 2 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	MASW6030G
OCR Text	...d the perimeter of the chip. B. cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used by is not required. 1.8 1.6 1.4 1.2 1.0 0 1 2 3 4 5 6 7 Frequency (GHz) Isolation @ 25C 8...
Description	GaAs DPDT Switch DC - 6.0 GHz
File Size	72.18K / 3 Page	View it Online	Download Datasheet

				http:// ITT[ITT Industries]
Part No.	FOHC-SA1219JN FOHC-SA1219JP FOHC-PA1219JN FOHC-PA1219JP FOHC-SH2800PP FOHC FOHC-PA1219PN FOHC-PA1219PP FOHC-PA1321JN FOHC-PA1321JP FOHC-PA1321PN FOHC-PA1321PP FOHC-PA1422JN FOHC-PA1422JP FOHC-PA1422PN FOHC-PA1422PP FOHC-PA1650JN FOHC-PA1650JP FOHC-PA1650PN FOHC-PA1650PP FOHC-PA2200JN FOHC-PA2200JP FOHC-PA2200PN FOHC-PA2200PP FOHC-PA2400JN FOHC-PA2400JP FOHC-PA2400PN FOHC-PA2400PP FOHC-PA2600JN FOHC-PA2600JP FOHC-PA2600PN FOHC-PA2600PP FOHC-PA2800JN FOHC-PA2800JP FOHC-PA2800PN FOHC-PA2800PP FOHC-PB1219JN FOHC-PB1219JP FOHC-PB1219PN FOHC-PB1219PP FOHC-PB1321JN FOHC-PB1321JP FOHC-PB1321PN FOHC-PB1321PP FOHC-PB1422JN FOHC-PB1422JP FOHC-PB1422PN FOHC-PB1422PP FOHC-PB1650JN FOHC-PB1650JP FOHC-PB1650PN FOHC-PB1650PP FOHC-PB2200JN FOHC-PB2200JP FOHC-PB2200PN FOHC-PB2200PP FOHC-PB2400JN FOHC-PB2400JP FOHC-PB2400PN FOHC-PB2400PP FOHC-PB2600JN FOHC-PB2600JP FOHC-PB2600PN FOHC-PB2600PP FOHC-PB2800JN FOHC-PB2800JP FOHC-PB2800PN FOHC-PB2800PP FOHC-PC1219JN FOHC-PC1219JP FOHC-PC1219PN FOHC-PC1219PP FOHC-PC1321JN FOHC-PC1321JP FOHC-PC1321PN FOHC-PC1321PP FOHC-PC1422JN FOHC-PC1422JP FOHC-PC1422PN FOHC-PC1422PP FOHC-PC1650JN FOHC-PC1650JP FOHC-PC1650PN FOHC-PC1650PP FOHC-PC2200JN FOHC-PC2200JP FOHC-
OCR Text	... and the epoxy is reflowed in a cure fixture. No mixing of liquids is required; the volume and flow viscosity is controlled, resulting in a perfect bond and the elimination of clean-up. Socket .113 (2.87) DIA .033 (0.84) .054 (1.37) .087 ...
Description	Fiber Optic Contacts
File Size	156.34K / 3 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC561
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 deg. C and a ball ...
Description	GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT
File Size	328.19K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC594
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2 - 4 GHz
File Size	267.01K / 6 Page	View it Online	Download Datasheet

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