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  modified through-hole header Datasheet PDF File

For modified through-hole header Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0015477632 15-47-7632

Molex Electronics Ltd.
Part No. 0015477632 15-47-7632
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

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    0015800145 15-80-0145 70567-0141

Molex Electronics Ltd.
Part No. 0015800145 15-80-0145 70567-0141
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    0015800165 15-80-0165 70567-0142 A-70567-0142

Molex Electronics Ltd.
Part No. 0015800165 15-80-0165 70567-0142 A-70567-0142
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

File Size 1,218.25K  /  7 Page

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    0015477638 15-47-7638

Molex Electronics Ltd.
Part No. 0015477638 15-47-7638
Description 2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, 0.38渭m (15渭) Gold (Au) Selective Platin

File Size 377.46K  /  4 Page

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    0850032529 85003-2529

Molex Electronics Ltd.
Part No. 0850032529 85003-2529
Description 2.54mm (.100) Pitch DIN 41612 header, Style C, Right Angle , Through Hole ,1μm (40μ) Selective Gold (Au) , 96 Circuits, First-Mate-Last-Break Pins Available, Lead free
2.54mm (.100) Pitch DIN 41612 header, Style C, Right Angle , Through Hole ,1楼矛m (40楼矛) Selective Gold (Au) , 96 Circuits, First-Mate-Last-Break Pins Available,
MOLEX Connector

File Size 76.57K  /  3 Page

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    0015800209 15-80-0209 A-70567-0280

Molex Electronics Ltd.
Part No. 0015800209 15-80-0209 A-70567-0280
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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    0015800149 15-80-0149 A-70567-0277

Molex Electronics Ltd.
Part No. 0015800149 15-80-0149 A-70567-0277
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    0015800163 15-80-0163

Molex Electronics Ltd.
Part No. 0015800163 15-80-0163
Description 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    87891-0206 0878910206

Molex Electronics Ltd.
Part No. 87891-0206 0878910206
Description 2.54mm (.100) Pitch KK庐 header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54渭m (100渭) Tin (Sn) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray Packaging, Lead-free

File Size 759.15K  /  10 Page

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For modified through-hole header Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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