20ns pdf Datasheet P2 Description --- IC-ON-LINE


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20ns Datasheet PDF File

For 20ns Found Datasheets File :: 59+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 |

					Vishay
Part No.	UG18CCT UGF18DCT UGB18ACT UGB18CCT UGB18DCT UG18DCT UGF18ACT UGF18BCT
Description	Dual Ultrafast Plastic Rectifiers, Forward Current 18A, Reverse Recovery Time 20ns
File Size	44.01K / 3 Page	View it Online	Download Datasheet

					ADVANCED MICRO DEVICES INC
Part No.	AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT-80DPI2 AM29LV800BT-80DWC2 AM29LV800BT-80DWI2 AM29LV800BT-80DGC2 AM29LV800BT-80DTI2 AM29LV800BT-80DPC2 AM29LV800BB-80DGI2 AM29LV800BB-80DPI2 AM29LV800BB-80DTI2 AM29LV800BB-80DWC2 AM29LV800BB-80DWI2 AM29LV800BB-80DPC2 AM29LV800BB-80DGC2 AM29LV800BB-80DTC2 AM29LV800BB-120DTC2 AM29LV800BT-90DPI2 AM29LV800BT-90DTI2 AM29LV800BT-90DWI2 AM29LV800BT-120DTI2 AM29LV800BB-120DTI2 AM29LV800BT-120DGI2 AM29LV800BT-120DTC2 AM29LV800BB-90DTI2 AM29LV800BB-90DGC2 AM29LV800BB-120DGC2 AM29LV800BT-120DPC2 AM29LV800BT-90DPC2 AM29LV800BT-120DWI2 AM29LV800BB-120DPC2 AM29LV800BB-90DPC2 AM29LV800BB-90DWI2
Description	25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD) 20ns, OTP, PLCC, COM TEMP(EPLD) 20ns, SOIC, IND TEMP(EPLD) 25NS, SOIC, COM TEMP(EPLD) 20ns,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD) 10MHZ, 8 DIP, COM TEMP(FPGA) 10MHZ, 20 PLCC, IND TEMP(FPGA) 10MHZ, 32 TQFP, COM TEMP(FPGA) 10MHZ, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE) DIE SALE, 1.8V, 11 MIL(SERIAL EE) 8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE) 65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA) 10MHZ, 20 SOIC, IND TEMP(FPGA) 128K CONFIG MEM, 20 PLCC, COM(FPGA) EEPROM EEPROM 10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM 512K X 16 FLASH 3V PROM, 120 ns, UUC44 10MHZ, 8 LAP, 5K MOQ(FPGA) 10MHZ, 8 N-SOIC, COM TEMP(FPGA) 10MHZ, 20 PLCC, COM TEMP(FPGA) 512K X 16 FLASH 3V PROM, 80 ns, UUC44
File Size	127.66K / 11 Page	View it Online	Download Datasheet

					White Electronic Designs
Part No.	WMS256K16-20DLM WMS256K16-25DLM WMS256K16-35DLM WMS256K16-20FGIA
Description	20ns; 256K x 16 monilithic SRAM, SMD 5962-96902 x16 SRAM
File Size	110.36K / 7 Page	View it Online	Download Datasheet

					Integrated Device Technology, Inc.
Part No.	7280L20PA
Description	FIFO 256X9 20ns TSSOP56 512 X 9 BI-DIRECTIONAL FIFO, 20 ns, PDSO56
File Size	145.26K / 11 Page	View it Online	Download Datasheet

					MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products] Maxim Integrated Products, Inc.
Part No.	MAX5054 MAX5057 MAX5056 MAX5054AATA MAX5057BASA MAX5054BATA MAX5055 MAX5055AASA MAX5055BASA MAX5056AASA MAX5056BASA MAX5057AASA
Description	4A, 20ns, Dual MOSFET Drivers 4 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO8
File Size	423.67K / 17 Page	View it Online	Download Datasheet

					Vishay
Part No.	UGB10DCT BYQ28ESERIES BYQ28EBSERIES BYQ28EFSERIES UGF10BCT UGF10CCT UGF10DCT
Description	Dual Ultrafast Soft Recovery Rectifiers Forward Current 10 A Reverse Recovery Time 20ns
File Size	51.78K / 3 Page	View it Online	Download Datasheet

					IRF[International Rectifier]
Part No.	IR2011 IR2011SPBF IR2011S IR2011PBF
Description	V(offset): 200V; 1A; V(out): 10-20V; 80 & 60ns (20ns - max); high and low side driver. For audio class D amplifiers, high power DC-DC SMPS converters, etc.
File Size	139.95K / 17 Page	View it Online	Download Datasheet

					Intel, Corp.
Part No.	PUMA2S16000M-025 PUMA77S16000M-020 PUMA2S16000I-025 PUMA77S16000AI-35 PUMA77S16000I-025 PUMA77S16000MB-025 PUMA2S16000MB-025 PUMA77S16000-020 PUMA77S16000AMB-020 PUMA77S16000AI-020 PUMA77S16000AM-025
Description	15NS, 68 PLCC, IND TEMP(EPLD) SRAM\|512KX32\|CMOS\|PGA\|66PIN\|CERAMIC 15NS, 68 PLCC, COM TEMP(EPLD) SRAM\|512KX32\|CMOS\|QFP\|68PIN\|CERAMIC 20ns, 44 PLCC, IND TEMP(EPLD) 30MHZ, 20 PLCC, IND TEMP, GREEN(FPGA) 15NS, TQFP, COM TEMP, ROHS-A(EPLD) 20ns, 44 TQFP, COM TEMP(EPLD) 7NS, 44 TQFP, COM TEMP, GREEN(EPLD) 30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA) 静态存储器\| 512KX32 \|的CMOS \|美巡赛\| 66PIN \|陶瓷
File Size	196.28K / 10 Page	View it Online	Download Datasheet

					DB Lectro, Inc. TE Connectivity, Ltd.
Part No.	PUMA67S16000M-025 PUMA2S16000I-45 PUMA67S16000I-45 PUMA77S16000I-45 PUMA2S16000M-55 PUMA67S16000M-55 PUMA77S16000M-55 PUMA2S16000M-45 PUMA67S16000M-45 PUMA77S16000M-45 PUMA67S16000AI-35 PUMA67S16000I-025 PUMA67S16000AMB-025 PUMA67S16000MB-025 PUMA77S16000AI-45 PUMA77S16000AMB-55 PUMA2S16000MB-55 PUMA67S16000AI-025 PUMA77S16000-55 PUMA77S16000AMB-45 PUMA67S16000A-025
Description	150NS, PLCC, COM TEMP(FLASH) 15NS, 44 PLCC, COM TEMP(EPLD) 30MHZ, 3.3V, 8 LAP, COM TEMP(FPGA) 20ns, 44 PLCC, COM TEMP(EPLD) 150NS, TSOP, IND TEMP(FLASH) 20ns, 44 TQFP, IND TEMP(EPLD) 120ns, SOIC, IND TEMP(EEPROM) 70NS, TSOP, IND TEMP(EEPROM) 15NS, 68 PLCC, IND TEMP(EPLD) 25NS, 68 PLCC, IND TEMP(EPLD) 30MHZ, 32 TQFP, COM TEMP(FPGA) 120ns, PDIP, IND TEMP(EEPROM) 32 MCROCELL CPLD 1.8V ISP TQFP IND GREEN(EPLD) x32 SRAM Module X32号的SRAM模块 90NS, TSOP, IND TEMP(EEPROM) X32号的SRAM模块 120ns, PLCC, IND TEMP(EEPROM)
File Size	423.30K / 10 Page	View it Online	Download Datasheet

					Aeroflex Circuit Technology
Part No.	5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 5962D0053601TXC 5962D0053602QXA 5962D0053602TUC 5962D0053602QXC 5962D0053603QUA 5962D0053601TUA 5962D0053601QXX 5962D0053601TUC 5962D0053601TUX 5962D0053602TUX 5962D0053602QUX 5962D0053602TXX 5962D0053602QXX 5962D0053602QUA 5962D0053601QXA 5962D0053601TXX 5962D0053602QUC 5962D0053602TXC 5962D0053601QXC 5962D0053602TUA 5962D0053601QUX 5962D0053601QUC 5962D0053603QUX 5962D0053603QXA 5962D0053603QXX 5962D0053603QXC 5962D0053603QUC UT9Q512-IWX UT9Q512-IWC UT9Q512-20ICC UT9Q512-20ICX UT9Q512-20IPC UT9Q512-20IWC UT9Q512-20UCC UT9Q512-20UCA UT9Q512-20UCX UT9Q512-20UWA UT9Q512-ICA UT9Q512-IPC UT9Q512-20ICA UT9Q512-20IWA UT9Q512-20IWX UT9Q512-20UPC UT9Q512-20UWC UT9Q512-20UWX UT9Q512-ICC UT9Q512-ICX UT9Q512-IWA UT9Q512-UCA 5962D0053603TXC 5962D0053604TXC 5962L0053601TXC 5962L0053602TXC 5962L0053603TXC 5962L0053604TXC 5962P0053601TXC 5962P0053602TXC 5962P0053603TXC 5962P0053604TXC 5962L0053601QUA 5962L0053601QUC 5962L0053601QUX 5962L0053601QXA 5962L0053601QXC 5962L0053601QXX 5962L0053601TUA 5962L0053601TUC 5962L0053601TUX 5962L0053601TXX 5962L0053602QUA 5962L0053602QUC 5962L0053602QUX 5962L0053602QXA 5962L0053602QXC 5962L0053602TUA 5962L0053602
Description	512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
File Size	128.60K / 15 Page	View it Online	Download Datasheet

For 20ns Found Datasheets File :: 59+ Page :: | 1 | <2> | 3 | 4 | 5 | 6 |

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