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  bumped Datasheet PDF File

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    NXP Semiconductors N.V.
Part No. MF0ICU1001W
Description 120 micro m bumped sawn wafer on UV-tape contactless single-trip ticket ICs
File Size 43.48K  /  5 Page

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    24005

Aries Electronics, Inc.
Part No. 24005
Description Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, μBGA and bumped Die Devices
File Size 1,104.07K  /  2 Page

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    Analog Devices, Inc.
Part No. ADP2126ACDZ-1.20R7
Description 1.291 A SWITCHING REGULATOR, 6800 kHz SWITCHING FREQ-MAX, PBGA6 0.330 MM HEIGHT, ROHS COMPLIANT, bumped-CHIP-6
File Size 853.85K  /  20 Page

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    JRC
Part No. NJU6433B
Description 4Com50Seg / bumped Chip / Chip / QFP64-G1 / QFP64-H1
File Size 250.59K  /  12 Page

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