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bumped Datasheet PDF File

For bumped Found Datasheets File :: 538 Search Time::1.282ms
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				Hitachi Semiconductor
Part No.	HCD66740
OCR Text	...i2c bus interface hcd66740bp au-bumped chip 4/8-bits parallel and clock synchronized serial hcd66740wbp au-bumped chip 4/8-bits parallel and i2c bus interface 1.8 v to 3.6 v hd66740 4 lcd specification comparison (under development) ite...
Description	112 x 80-dot Graphics LCD Controller/Driver
File Size	918.95K / 95 Page	View it Online	Download Datasheet

				HITACHI[Hitachi Semiconductor]
Part No.	HCD66731A01BP HCD66731A00BP HCD66730A01 HCD66730A00 HD66730 HD66730A00FS HD66730A01FS HD66731 HD66731A00TA0L HD66731A00TB0L HD66731A01TA0L HD66731A01TB0L
OCR Text	...hip Straight TCP Bending TCP Au-bumped chip FP-128 Bare chip Straight TCP Bending TCP Au-bumped chip Number of Display character Two 6-characters Two 6-characters Three 8-characters Four 10-characters Four 10-characters Two 6-characters Two...
Description	Dot-Matrix Liquid Crystal Display Controller/Driver Supporting Japanese Kanji, Korean Font Display
File Size	5,302.31K / 131 Page	View it Online	Download Datasheet

				Samsung Electronic
Part No.	KS0708
OCR Text	...S process U Package : available bumped chip M/M-96-D001 97-09-19 1 PRELIMINARY SPECIFICATION KS0708 BLOCK DIAGRAM 64COM/128SEG DRIVE FOR DOT MATRIX LCD C1 ... C32 ... S1 S2 ... ... S63 S64 S65 S66 ... ...
Description	64COM/128SEG DRIVE FOR DOT MATRIX LCD
File Size	211.69K / 27 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text	bumped sawn wafer on uv-tape? august 2004 product specification revision 3.0 public p h i l i p s s e m i c o n d u c t o r s addendum philips semiconductors produ ct specification rev. 3.0 august 2004 bumped sawn wafer on uv-tape stand...
Description	Standard Card IC Specification B>bumped sawn wafer on UV-tape
File Size	33.19K / 7 Page	View it Online	Download Datasheet

				Zarlink
Part No.	ZL70010 ZL70009 ZL70008 ZL70002
OCR Text	... Standard delivery form: solder bumped die Facilitates compliance with EN-45502 and EN50061 DS5666 Issue 1 July 2002 Ordering Information ZL70002/UDJ bumped Die, Waffle ZL70008/UDJ bumped Die, Waffle ZL70009/UDJ bumped Die, Waffle ZL700...
Description	Medical Surge Protection Devices From old datasheet system
File Size	348.22K / 12 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	S6B0708
OCR Text	... High voltage CMOS process Gold bumped chip available 1 S6B0708 LCD 64COM/128SEG GRAPHIC DRIVER FOR DOT MATRIX BLOCK DIAGRAM C1 ... C32 S1 S2 ... S63 S64 S65 S66 ... S127 S128 C33...C64 ... ... ... ... VDD V0 V1 ...
Description	64COM/128SEG GRAPHIC DRIVER FOR DOT MATRIX LCD
File Size	286.95K / 29 Page	View it Online	Download Datasheet

For bumped Found Datasheets File :: 538 Search Time::1.282ms
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