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MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc] ON Semi
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Part No. |
MCCF33094 ON1783
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OCR Text |
...perating temperatures. * Solder Bumped for Flip-Chip Assembly
* * * * * * * * * *
FLIP-CHIP CONFIGURATION
14 13 2
External Capacitors to Set Device Timing Overvoltage Shutdown Protection Auto Start-Up Capability Once Overvoltage C... |
Description |
From old datasheet system IGNITION CONTROL FLIP-CHIP
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File Size |
47.66K /
2 Page |
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it Online |
Download Datasheet
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Zarlink
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Part No. |
ZL70010 ZL70009 ZL70008 ZL70002
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OCR Text |
... Standard delivery form: solder bumped die Facilitates compliance with EN-45502 and EN50061
DS5666 Issue 1 July 2002
Ordering Informatio...chip to lot and wafer number 100% burn-in capability The ZL70002/08/09/10 family are high performanc... |
Description |
Medical Surge Protection Devices From old datasheet system
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File Size |
348.22K /
12 Page |
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it Online |
Download Datasheet
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NJRC[New Japan Radio]
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Part No. |
NJU6680 NJU6680CL
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OCR Text |
...ge 6.0 to 18.0V Package Outline Bumped Chip C-MOS Technology ( Substrate : P )
Ver.2003-04-08
-1-
NJU6680
PAD LOCATION
TEST2 DUMMY29 TEST3 DUMMY30 C63 C62 C61 C31 C30 C29 C28 DUMMY31 DUMMY32 DUMMY33
DUMMY34 DUMMY35 DUMMY36 DUM... |
Description |
128-common x 128-segment 4-level Gray Scale BITMAP LCD DRIVER From old datasheet system
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File Size |
474.15K /
56 Page |
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it Online |
Download Datasheet
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Price and Availability
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