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ARF475FL 250AT MJD45H11 50001 SGX40G 00A2E2 BAT41 22904
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  sawn Datasheet PDF File

For sawn Found Datasheets File :: 795    Search Time::9.328ms    
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    NXP
Part No. SL2ICS2001V1D
OCR Text sawn wafers on ffc with uv-tape of i-code sli label ics on an nxp c075ee process and is the base for delivery of tested i-code sli label ics. 2. ordering information 3. mechanical specification 3.1 wafer ? diameter: 8? ? thickness: 150 ...
Description I-CODE SLI Label IC bumped wafer specification on UV-tape

File Size 198.40K  /  9 Page

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    HTMS8201FTK HTMS8X01

NXP Semiconductors
Part No. HTMS8201FTK HTMS8X01
OCR Text ...mber (uid) 2.6 delivery types ? sawn, gold-bumped 8? wafer ? hvson2 ? sot-1122 3. applications ? animal identification ? laundry automation ? beer keg and gas cylinder logistic ? brand protection 4. quick reference data [1] measured with...
Description HITAG transponder IC

File Size 464.09K  /  57 Page

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    SLE4406SPEC SLE4406SPEMFC3 SLE4406SPEM3

INFINEON TECHNOLOGIES AG
Part No. SLE4406SPEC SLE4406SPEMFC3 SLE4406SPEM3
OCR Text ... sle 4406sp d die (on wafer) sawn sle 4406sp m3 t-m3.2-6 sle 4406sp mfc3 s-mfc3.1-6-1 fcos? data of 3rd byte are programmed by infineon exclusively sle 4406spe c die (on wafer) unsawn sle 4406spe d die (on wafer) sawn sle 4...
Description 512 X 1 EEPROM 5V, UUC
512 X 1 EEPROM 5V, DMA

File Size 257.30K  /  6 Page

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    HTSMOH5601EV HTSH4801ETK HTSH5601ETK HTSFCH5601EV HTSICH5601EW HTSICC4801EW HTSICH4801EW

NXP Semiconductors
Part No. HTSMOH5601EV HTSH4801ETK HTSH5601ETK HTSFCH5601EV HTSICH5601EW HTSICC4801EW HTSICH4801EW
OCR Text ...entication 2.6 delivery types ? sawn, gold - bumped 8? wafer ? sawn, gold - megabumped 8? wafer ? contactless chip card module moa2 ? i ? connect (low cost flip chip package) ? hvson2 3. applications ? animal identification ? laundry autom...
Description HITAG S transponder IC SPECIALTY TELECOM CIRCUIT, UUC

File Size 107.86K  /  21 Page

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    NXP Semiconductors N.V.
Part No. SL1ICS3001W/N4D
OCR Text ............. 15 11.2.1 packing of sawn wafers ................................ ................................ ............................. 15 12 handling recommendations 16 12.1 assembly ................................ ......................
Description I-CODE1 Label IC SPECIALTY CONSUMER CIRCUIT, UUC

File Size 343.06K  /  24 Page

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    SAK-C505CA-LC

Infineon Technologies AG
Part No. SAK-C505CA-LC
OCR Text ...omments sak-c505ca-lc tbd whole/sawn 8-bit microcontroller with temperature range: -40 c to +125 c (max. operating frequency: 20 mhz with 50% duty cycle) saa-c505ca-lc tbd whole/sawn 8-bit microcontroller with temperature range: -40...
Description CONNECTOR ACCESSORY

File Size 324.37K  /  22 Page

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    NXP Semiconductors N.V.
Part No. SL3S1213FUF SL3S1203AC2 SL3S1203FUD SL3S1213FUD SL3S1203AC0 SL3S1203FTB0 SL3S1203FUF SL3S1213FTB0
OCR Text ...203fuf wafer g2il bumped die on sawn 8? 75 ? m wafer not applicable sl3s1213fuf wafer g2il+ bumped die on sawn 8? 75 ? m wafer not applicable sl3s1203fud/bg [1] wafer g2il bumped die on sawn 8? 120 ? m wafer, 7 ? m polyimide spacer not ...
Description UCODE G2iL and G2iL

File Size 495.04K  /  43 Page

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