TIM5964-30SL pdf Datasheet P3 Part Num --- IC-ON-LINE


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TIM5964-30SL Datasheet PDF File

For TIM5964-30SL Found Datasheets File :: 83+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 |

					Toshiba Semiconductor
Part No.	TIM5964-35SLA-422
Description	MICROWAVE POWER GaAs FET
File Size	114.76K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	76342-330SLF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 60 Positions, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Toshiba Corporation Toshiba Semiconductor
Part No.	TIM5964-35SLA-251
Description	MICROWAVE POWER GaAs FET TIM5964-35SLA-251 From old datasheet system
File Size	36.69K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	71991-330SLF
Description	Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 60 Position, 2.54mm (0.100in) Pitch
Tech specs				Official Product Page

					OPTEK Technologies
Part No.	OP830SL
Description	NPN Silicon Photodarlington
File Size	360.10K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	89361-130SLF
Description	Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs				Official Product Page

					Toshiba Semiconductor
Part No.	TIM5964-60SL08
Description	IM3=-45 dBc at Pout= 36.5dBm Single Carrier Level
File Size	103.73K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	89947-130SLF
Description	Minitek® 2.00mm, Wire/Cable To Board Connectors, IDC 2mm Receptacle Board/Wire to Board Connectors, Double Row, 30 Position, 2mm Pitch
Tech specs				Official Product Page

					Toshiba Semiconductor
Part No.	TIM5964-16UL TIM5964-16UL09
Description	HIGH POWER P1dB=42.5dBm at 5.9GHz to 6.4GHz
File Size	117.28K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	89361-730SLF
Description	Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs				Official Product Page

					Toshiba Semiconductor
Part No.	TIM5964-25UL TIM5964-25UL09
Description	HIGH POWER P1dB=44.5dBm at 5.9GHz to 6.4GHz
File Size	117.62K / 4 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	89947-730SLF
Description	Minitek® 2.00mm, Wire/Cable To Board Connectors, IDC 2mm Receptacle Board/Wire to Board Connectors, Double Row, 30 Position, 2mm Pitch
Tech specs				Official Product Page

					Toshiba Semiconductor
Part No.	TIM5964-45SL06
Description	MICROWAVE POWER GaAs FET
File Size	507.24K / 4 Page	View it Online	Download Datasheet

						Texas Instruments
Part No.	LMX2430SLEX/NOPB
Description	3.0 GHz/0.8 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications 20-ULGA -40 to 85
Tech specs			Get Free Sample	Official Product Page

					Toshiba Semiconductor
Part No.	TIM5964-80SL08
Description	IM3=-30 dBc at Pout= 42.0dBm Single Carrier Level
File Size	109.02K / 4 Page	View it Online	Download Datasheet

					Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	FU-630SLD-8M1 FU-630SLD-10M1 FU-630SLD-12M1
Description	1.48 um PUMP LD MODULE WITH SINGLEMODE FIBER (EDFA) 劳工.48微米泵模块，单模光纤（掺铒光纤放大器
File Size	59.63K / 3 Page	View it Online	Download Datasheet

					Japan Aviation Electronics Industry, Ltd.
Part No.	FI-XPB30SL-HF10
Description	BOTTOM TYPE
File Size	133.95K / 1 Page	View it Online	Download Datasheet

For TIM5964-30SL Found Datasheets File :: 83+ Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 |

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Part: TIM5964-30SL

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