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  04500 Datasheet PDF File

For 04500 Found Datasheets File :: 78+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |   

    ATS045045002-MF-15A

Advanced Thermal Solutions, Inc.
Part No. ATS045045002-MF-15A
Description 45.00 x 45.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.98K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-104500LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS045045003-PF-15B

Advanced Thermal Solutions, Inc.
Part No. ATS045045003-PF-15B
Description 45.00 x 45.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 249.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 48045-000LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    ATS045045003-MF-15B

Advanced Thermal Solutions, Inc.
Part No. ATS045045003-MF-15B
Description 45.00 x 45.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.85K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-104500800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    ATS045045008-MF-15G

Advanced Thermal Solutions, Inc.
Part No. ATS045045008-MF-15G
Description 45.00 x 45.00 x 8.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 280.01K  /  1 Page

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Amphenol Communications Solutions

Part No. 67045-006LF
Description Quickie®, Wire To Board, Strain Relief, 6 Positions
Tech specs    

Official Product Page

    ATS045045004-SF-15C

Advanced Thermal Solutions, Inc.
Part No. ATS045045004-SF-15C
Description 45.00 x 45.00 x 4.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 67045-008LF
Description Quickie®, Wire To Board, Strain Relief, 8 Positions
Tech specs    

Official Product Page

    ATS045045005-MF-15D

Advanced Thermal Solutions, Inc.
Part No. ATS045045005-MF-15D
Description 45.00 x 45.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.99K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-204500PLF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    ATS045045009-MF-15H

Advanced Thermal Solutions, Inc.
Part No. ATS045045009-MF-15H
Description 45.00 x 45.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-804500800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS045045009-SF-15H

Advanced Thermal Solutions, Inc.
Part No. ATS045045009-SF-15H
Description 45.00 x 45.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-104500950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS045045007-SF-15F

Advanced Thermal Solutions, Inc.
Part No. ATS045045007-SF-15F
Description 45.00 x 45.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 48045-002LF
Description PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
Tech specs    

Official Product Page

    ATS045045007-MF-15F

Advanced Thermal Solutions, Inc.
Part No. ATS045045007-MF-15F
Description 45.00 x 45.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.93K  /  1 Page

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