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STMicro
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| Part No. |
ST16ST2G 5009
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| OCR Text |
...e delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package.
Figure 1. Block Diagram
V GENERATION PP
RAM
8 BIT 384
SYSTEM ROM
1.5 KBtyte
ROM
15 KBytes
CPU
BYTES
SECTORS... |
| Description |
Smartcard MCU With up to 16352 Bytes EEPROM & T2G Authentication Library
From old datasheet system
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| File Size |
28.17K /
2 Page |
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it Online |
Download Datasheet
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STMicro
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| Part No. |
ST1200 5002
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| OCR Text |
...available in wafer form (either sawn or unsawn) and in micromodule form (on film). For deliveries in wafer form, the memory content is at logical "0", except for the 9th bit (bit 8). If the delivery is in micromodule, the first bit (bit 0) ... |
| Description |
Memory Card IC 256 bit OTP EPROM with Lock-Out
From old datasheet system
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| File Size |
26.22K /
2 Page |
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it Online |
Download Datasheet |
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意法半导
STMICROELECTRONICS[STMicroelectronics]
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| Part No. |
ST16600 5806
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| OCR Text |
...e delivered either in unsawn or sawn wafers, 180 or 275 micron thickness as well as in micromodule package.
Figure 1. Block Diagram
V GENERATION PP
RAM
8 BIT 128
SYSTEM ROM
1 KBtytes
ROM
6 KBytes
CPU
BYTES
SECTORS C... |
| Description |
Pulse Width Modulation (PWM) Controller IC; Topology:Boost, Flyback, Forward; Control Mode:Voltage; Number of PWM Outputs:1; Input Voltage Primary
Smartcard MCU With 512 Bytes EEPROM
From old datasheet system
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| File Size |
26.77K /
2 Page |
View
it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SIDC01D120H6 Q67050-A4171-A001
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| OCR Text |
...e Size 1.2 x 1.1 mm2
Package sawn on foil
Ordering Code Q67050-A4171A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside An... |
| Description |
Fast switching diode chip in EMCON-Technology
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| File Size |
65.31K /
4 Page |
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it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SIDC02D60C6
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| OCR Text |
... Size 1.4 x 1.65 mm2
Package sawn on foil
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization Cathode metalliz... |
| Description |
Fast switching diode chip in EMCON 3 -Technology
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| File Size |
59.54K /
4 Page |
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it Online |
Download Datasheet |
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INFINEON[Infineon Technologies AG]
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| Part No. |
SIDC02D60F6 Q67050-A4157-A001
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| OCR Text |
...e Size 1.3 x 1.3 mm2
Package sawn on foil
Ordering Code Q67050-A4157A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside An... |
| Description |
Fast switching diode chip in EMCON-Technology
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| File Size |
68.17K /
4 Page |
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it Online |
Download Datasheet |
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Price and Availability
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