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  bumped-chip-6 Datasheet PDF File

For bumped-chip-6 Found Datasheets File :: 378    Search Time::2.875ms    
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    Samsung Electronic
Part No. KS0070 KS0070B
OCR Text ...xternal resistor * Bare chip or bumped chip available KS0070B 16COM / 80SEG DRIVER & CONTROLLER FOR DOT MATRIX LCD BLOCK DIAGRAM VDD GND V1 V2 V3 V4 V5 5 Busy Flag Character Generator ROM (CG ROM) 8320 bits Parallel to serial...
Description 16COM / 80SEG DRIVER & CONTROLLER FOR DOT MATRIX LCD

File Size 553.10K  /  42 Page

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    TDA5360 TDA5360UH TDA5360UK

Philips Semiconductors
Part No. TDA5360 TDA5360UH TDA5360UK
OCR Text ....1 Type Number PACKAGE bare die bumped die 1998 July 30 5 Philips Semiconductors Objective Specification, Revision 2.2 Pre-Am...Chip ID Code for Chip ID 1998 July 30 8 Philips Semiconductors Objective Specification, ...
Description Pre-Amplifier for Hard Disk Drive with MR-Read / Inductive Write Heads

File Size 179.11K  /  34 Page

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    HITACHI[Hitachi Semiconductor]
Part No. HCD667A66RBP HD667B66R HCD667B66RBP HD66766R HD667A66R
OCR Text ...67B66RBP External Dimensions Au-bumped chip straight bump Au-bumped chip laced bump Difference between HCD667x66R and HCD667x66 Table 1 Difference Pad arrangement HCD667x66R Pad No. Pad Name 63 Vcc 63 Vcc 64 Vcc 66 Vcc 67 AVcc 68 AVcc 6...
Description 132 X 176-DOT GRAPHICS LCD CONTROLLER/DRIVER FOR 65K COLORS

File Size 665.13K  /  97 Page

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    XRA00 XRA00-W4I XRA00-SBN18I

STMICROELECTRONICS[STMicroelectronics]
Part No. XRA00 XRA00-W4I XRA00-SBN18I
OCR Text ...awn unbumped wafers or sawn and bumped wafers October 2005 1/40 XRA00 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
Description UHF, EPCGLOBAL, CONTACTLESS MEMORY IC 96 BIT EPC WITH INVENTORY AND KILL FUNCTION

File Size 246.11K  /  40 Page

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    N/A
ETC[ETC]
Part No. UC1608 UC1608XGAC UC1608XFAC
OCR Text ...GAC UC1608xFAC Description Gold bumped die. COF packaging. General Notes APPLICATION INFORMATION For improved readability, the specifica...Chip Select. The chip is selected when CS="H". When the chip is not selected, D[7:0] will be high im...
Description 128COM x 240SEG Matrix LCD Controller-Driver

File Size 978.87K  /  42 Page

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    XRAG2 XRAG2-W4I XRAG2-SBN18I

意法半导
STMicroelectronics
Part No. XRAG2 XRAG2-W4I XRAG2-SBN18I
OCR Text ...awn unbumped wafers or sawn and bumped wafers August 2005 For further information contact your local STMicroelectronics sales office. Rev. 2 1/8 www.st.com 8 1 Summary description XRAG2 1 Summary...
Description UHF, EPCGLOBAL CLASS-1 GENERATION-2, CONTACTLESS MEMORY CHIP 432 BIT WITH MULTI-SESSION PROTOCOL, ANTI-COLLISION AND KILL FUNCTIONS

File Size 49.29K  /  8 Page

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    S6A0070

Samsung Electronic
Samsung semiconductor
Part No. S6A0070
OCR Text ...n external resistor Bare die or bumped chip available * * * * * * 2 80 SEG / 16 COM DRIVER & CONTROLLER FOR DOT MATRIX LCD S6A0070 BLOCK DIAGRAM VDD GND V1 V2 V3 V4 V5 Busy Flag Parallel/Serial Data Conversion Circuit 5...
Description 80 SEG / 16 COM DRIVER & CONTROLLER FOR DOT MATRIX LCD

File Size 397.38K  /  41 Page

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    HD66727A03TA0L HD66727A04TA0L HD66702R HD66712U HD66720 HD66727 HD44780U HCD66727A03 HCD66727A03BP HCD66727A04 HCD66727A

HITACHI[Hitachi Semiconductor]
Part No. HD66727A03TA0L HD66727A04TA0L HD66702R HD66712U HD66720 HD66727 HD44780U HCD66727A03 HCD66727A03BP HCD66727A04 HCD66727A04BP HD66710 HD66717
OCR Text ...rnal Dimension TCP Bare chip Au-bumped chip TCP Bare chip Au-bumped chip 2.4V to 5.5V PHS & Pager fonts Operation Voltage 2.4V to 5.5V Internal Font Japanese and European fonts 3 HD66727 LCD-II Family Comparison Item Power supply vo...
Description LOW-POWER DOT-MATRIX LIQUID CRYSTAL DISPLAY CONTROLLER/DRIVER WITH KEY SCAN FUNCTION

File Size 486.03K  /  97 Page

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    PCF8549 PCF8549U PCF8549U_2 PCF8549U_2_F1

Philips Semiconductors
NXP Semiconductors
Part No. PCF8549 PCF8549U PCF8549U_2 PCF8549U_2_F1
OCR Text ... The PCF8549U/2 is available as bumped die. Sawn wafer as chip sorted in chip tray. For further details see Section "Bonding pads". Customized TCP upon request. VERSION 1997 Nov 21 2 Philips Semiconductors Product specificati...
Description 65 X 102 PIXELS MATRIX LCD DRIVER

File Size 271.44K  /  36 Page

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    STE2001 STE2001DIE1 STE2001DIE2

STMicroelectronics
Part No. STE2001 STE2001DIE1 STE2001DIE2
OCR Text ...with the host controller. Type Bumped Wafers Bumped Dice on Waffle Pack Ordering Number STE2001DIE1 STE2001DIE2 Figure 1. Block Diag...chip where the Interface Pads are located), setting the TRS bit to a logic one, and on the Row Pads ...
Description    65 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER

File Size 309.43K  /  36 Page

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