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				ALPHA[Alpha Industries]
Part No.	DMK8001-000
OCR Text	...ut Excessive Epoxy Runout cure Epoxy & DC Continuity Check * Inspect for Adequate Epoxy Fillet * cure According to Mfg. Preferred Schedule. Typically 110-150C @ 60 Minutes, or 150C, 4 Minutes for Snap-cure Epoxies Alpha Industries...
Description	GaAs Flip Chip Schottky Diodes
File Size	83.90K / 4 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MA46H120
OCR Text	... Use a minimum amount of epoxy. cure epoxy per manufacturer's schedule. For extended cure times, temperatures must be kept below 200C. V3.00 M/A-COM Division Of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883...
Description	GaAs Constant Gamma Flip- Chip Varactor Diode
File Size	62.60K / 2 Page	View it Online	Download Datasheet

				Vishay
Part No.	M-BOND610FORTRANSDUCERS
OCR Text	...4 bar) 50 psi (3.4 bar) optimum cure requirements: recommended cure: 1 hours at + 350 f (+ 175 c) recommended postcure: 2 hours at + 400 to + 450 f (+ 205 to + 230 c) *altered for aluminum-alloy transducers. see strain gage insta...
Description	Strain Gage Adhesives for Transducer Applications
File Size	127.39K / 1 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	WLCSP
OCR Text	...erials pbo and polyimide, cure polymers, low cure polymers ? rdl metalization plated copper ? ubm thick cu or ni-based ? solder composition (ball loaded) pb-free sac alloys (plated) sn/ag pb-free, cu pillar shipping carrier...
Description	Wafer Level Processing and Die Processing Services
File Size	467.70K / 2 Page	View it Online	Download Datasheet

				http:// M/A-COM Technology Solutions, Inc.
Part No.	MA4E1317 MA4E1318 MA4E1319-1 MA4E1319-2 MA4E2160
OCR Text	... Use a minimum amount of epoxy. cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 200C. Handling Procedures The following precautions should be observed to avoid damaging these chips: ...
Description	GaAs Flip Chip Schottky Barrier Diodes
File Size	131.86K / 7 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MA4E1310
OCR Text	... Use a minimum amount of epoxy. cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 200 C. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * ...
Description	GaAs Flip Chip Schottky Barrier Diode
File Size	63.56K / 5 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	DN510
OCR Text	... of at least one psi during the cure cycle. 3. Place assembly in a preheated oven and cure at one of the following schedules: 1/2 hr @ 150C 2 hrs @ 125C The base material of the DN510 is Beryllia which provides efficient energy transfer ...
Description	SUBMINIATURE PROPORTIONALLY CONTROLLED HEATER
File Size	338.95K / 2 Page	View it Online	Download Datasheet

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