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Molex Electronics Ltd.
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Part No. |
87914-2815 0879142815
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole, dual row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, dual row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, dual row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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File Size |
3,777.37K /
48 Page |
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it Online |
Download Datasheet |
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Samtec, Inc.
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Part No. |
QTE-060-02-L-D-A QTE-020-04-L-D-A QTE-020-01-L-D-A QTE-040-02-L-D-A
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Description |
CONN header HI-SPEED dual 120POS 120 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT CONN header HI-SPEED dual 40POS 40 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT CONN header HI-SPEED dual 80POS 80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT
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File Size |
756.53K /
1 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole, dual row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, dual row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, dual row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole, dual row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, dual row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, dual row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87761-2400 0877612400
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> header, dual row dual Body, Through Hole, Vertical, 24 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating 2.00mm (.079) Pitch Milli-Grid header, dual row dual Body, Through Hole, Vertical, 24 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
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File Size |
297.15K /
5 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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