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For backside Found Datasheets File :: 6204    Search Time::1.25ms    
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    MIMIX[Mimix Broadband]
Part No. XP1011
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description 36.0-40.0 GHz GaAs MMIC Power Amplifier

File Size 153.26K  /  6 Page

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    MPX2300DT1

MOTOROLA[Motorola, Inc]
Part No. MPX2300DT1
OCR Text ...Pressure Sensor for Disposable, backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip ...
Description PRESSURE SENSORS

File Size 71.73K  /  4 Page

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    MPX2300 MPX2300D

Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MPX2300 MPX2300D
OCR Text backside Pressure Applications Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in ...
Description PRESSURE SENSORS

File Size 106.50K  /  4 Page

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    MIMIX[Mimix Broadband]
Part No. XP1012
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description 37.0-40.0 GHz GaAs MMIC Power Amplifier

File Size 154.81K  /  6 Page

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    MIMIX[Mimix Broadband]
Part No. XP1013
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-toPoint Radio, LMDS, SATCOM and VSAT ap...
Description 17.0-26.0 GHz GaAs MMIC Power Amplifier

File Size 1,540.52K  /  7 Page

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    MIMIX[Mimix Broadband]
Part No. XP1014
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for radar applications. Absolute Maximum Ratings Supply Volta...
Description 8.5-11.0 GHz GaAs MMIC Power Amplifier

File Size 161.91K  /  5 Page

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    MIMIX[Mimix Broadband]
Part No. XP1015
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description 43.5-46.5 GHz GaAs MMIC Power Amplifier

File Size 267.04K  /  5 Page

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    MIMIX[Mimix Broadband]
Part No. XP1016
OCR Text ... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description 43.5-46.5 GHz GaAs MMIC Power Amplifier

File Size 669.83K  /  5 Page

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