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  bumped-chip-6 Datasheet PDF File

For bumped-chip-6 Found Datasheets File :: 373    Search Time::2.672ms    
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    STE2004DIE2 STE2004DIE1 STE2004

STMICROELECTRONICS[STMicroelectronics]
Part No. STE2004DIE2 STE2004DIE1 STE2004
OCR Text ...rs STE2004DIE1 STE2004DIE2 Type Bumped Wafers Bumped Dice on Waffle Pack Figure 1. Block Diagram CO to C101 R0 to R64 OSC_IN OSC_...Chip Mechanical Drawing ROW 27 ROW 5 ROW 6 MARK_1 ROW28 ROW31 ROW 0 COL 0 FR_OUT OSC_O...
Description 102 X 65 SINGLE CHIP LCD CONTROLLER / DRIVER

File Size 571.76K  /  66 Page

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    UC1682 UC1682THCZ UC1682XHCZ UC1682TFBZ UC1682XFBZ

ETC[ETC]
Part No. UC1682 UC1682THCZ UC1682XHCZ UC1682TFBZ UC1682XFBZ
OCR Text ...ot available yet. Versions Gold Bumped Die with PI Gold Bumped Die with PI COF COF Description Without OTP option With OTP option Without OT...Chip Select. Chip is selected when CS1="H" and CS0 = "L". When the chip is not selected, D[7:0] will...
Description HIGH-VOLTAGE MIXED-SIGNAL IC

File Size 1,134.32K  /  70 Page

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    CX50101 CX51761 CX5000 CX50041 CX50211 CX50331 CX50561 CX50841 CX51191

List of Unclassifed Manufacturers
ETC[ETC]
Part No. CX50101 CX51761 CX5000 CX50041 CX50211 CX50331 CX50561 CX50841 CX51191
OCR Text ...d with an extra layer of metal, bumped and then mounted into a flip-chip package. ChipX has a vast library of standard packages, large pin count FPGA packages, military and hermetic packages. Custom package development services are reasonab...
Description 0.18um Structured ASIC

File Size 88.41K  /  6 Page

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    EM4550A6WW11 EM4550A5WS11 EM4550A6WS11 EM4550A6WS11E EM4550A6WS27E EM4450A5WS7E EM4450A6WW11 EM4450A6WW11E EM4450A6WW27

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EMMICRO[EM Microelectronic - MARIN SA]
EM Microelectronic - MA...
Part No. EM4550A6WW11 EM4550A5WS11 EM4550A6WS11 EM4550A6WS11E EM4550A6WS27E EM4450A5WS7E EM4450A6WW11 EM4450A6WW11E EM4450A6WW27 EM4450A6WW27E EM4450A6WW6 EM4450A6WW6E EM4450A6WW7 EM4450A6WW7E EM4550A6WW11E EM4550A6WW27 EM4550A6WW27E EM4550A6WW6 EM4550A6WW6E EM4550A6WW7 EM4550A6WW7E EM4550A6WT7E EM4450 EM4450A5CB2RC EM4450A5CI2LB EM4450A5CI2LC EM4450A5WS11 EM4450A5WS11E EM4450A5WS27 EM4450A5WS27E EM4450A5WS6 EM4450A5WS6E EM4450A5WS7 EM4450A5WT11 EM4450A5WT11E EM4450A5WT27 EM4450A5WT27E EM4450A5WT6 EM4450A5WT6E EM4450A5WT7 EM4450A5WT7E EM4450A5WW11 EM4450A5WW11E EM4450A5WW27 EM4450A5WW27E EM4450A5WW6 EM4450A5WW6E EM4450A5WW7 EM4450A5WW7E EM4450A6CB2RC EM4450A6CI2LB EM4450A6CI2LC EM4450A6WS11 EM4450A6WS11E EM4450A6WS27 EM4450A6WS27E EM4450A6WS6 EM4450A6WS6E EM4450A6WS7 EM4450A6WS7E EM4450A6WT11 EM4450A6WT11E EM4450A6WT27 EM4450A6WT27E EM4450A6WT6 EM4450A6WT6E EM4450A6WT7 EM4450A6WT7E EM4550 EM4550A5WS11E EM4550A5WS27 EM4550A5WS27E EM4550A5WS6 EM4550A5WS6E EM4550A5WS7 EM4550A5WS7E EM4550A5WT11 EM4550A5WT11E EM4550A5WT27 EM4550A5WT27E EM4550A5WT6 EM4550A5WT6E EM4550A5WT7 EM4550A5WT7E EM4550A5WW11 EM4550A5WW11E EM4550A5WW27 EM4550A5WW27E EM4550A5WW6 EM4550A5WW6E EM4550A5WW7 EM4550A5WW7E EM4550A6
OCR Text ...0 and EM4550 is that EM4550 are bumped and has megapads for the two coils. The chip contains 1 KBit of EEPROM which can be configured by the user, allowing a write inhibited area, a read protected area, and a read area output continuously a...
Description 1 KBit Read/Write Contactless Identification Device

File Size 230.96K  /  16 Page

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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. V6116V60TBA-3041 V6116V6WP27E V6116 V6116V6WP11E
OCR Text ... the LCD refresh signal TAB and bumped die form delivery. Other form delivery on request -40 to + 85 C temperature range Typical Operatin...chip. The data at DO is equal to the data at DI delayed by 48 clock periods. In order to cascade V61...
Description Digitally Programmable 2, 4 and 8 Mux LCD Driver

File Size 867.96K  /  15 Page

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    ATMEL[ATMEL Corporation]
Part No. AT24C512BN-10SU-1.8 AT24C512BY4-10YU-1.8 AT24C512B AT24C512B-10PU-1.8 AT24C512BC1-10CU-1.8 AT24C512B-W1.8-11
OCR Text ...es: Wafer Form, Waffle Pack and Bumped Die * * * * * * * * * Two-wire Serial EEPROM 512K (65,536 x 8) Description The AT24C512B p...chip for a read or write operation (see Figure 7 on page 9). The device address word consists of a m...
Description Two-wire Serial EEPROM 512K (65,536 x 8) with Three Device Address Inputs

File Size 305.04K  /  18 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

NXP Semiconductors
Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text bumped sawn wafer on UV-tape" Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors ...Chip Dimensions .......................................................................................
Description Standard Card IC Specification “bumped sawn wafer on UV-tape”

File Size 31.48K  /  7 Page

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    LX1801

Microsemi Corporation
Part No. LX1801
OCR Text ...le output voltage option Solder bumped die The MSC-LX1801 is the IC1 "Spark" for the MED427A-1 module. The "Spark" chip has an oscillator, a voltage doubler, and a level shifter. The oscillator is a "555" timer variant where the external...
Description High Voltage 1/2 Bridge Defibrillator Switch
SPARK for MED427A-1
From old datasheet system

File Size 158.00K  /  4 Page

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    LX1802

Microsemi Corporation
Part No. LX1802
OCR Text ...all form factor 0.889 mm Solder bumped die The MSC-LX1802 is the IC2 "Plug" for the MED427A-1 module. The "Plug" chip has peak rectifier, level shifter, and switch. This full wave peak rectifier converts the peak to peak AC input wavefor...
Description PLUG for MED427A-1

File Size 143.12K  /  5 Page

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    ATMEL[ATMEL Corporation]
Part No. AT24C16406 AT24C164-W2.7-11 AT24C164-10PU-1.8 AT24C164-10PU-2.7 AT24C164-10SU-1.8 AT24C164-10SU-2.7 AT24C164-W1.8-11
OCR Text ...es: Wafer Form, Waffle Pack and Bumped Wafers Two-Wire Serial EEPROM 16K (2048 x 8) AT24C164(1) Note: 1. Not recommended for a new d...chip for read or write operations (see Figure 7 on page 10). The most significant bit must be a one ...
Description Two-Wire Serial EEPROM 16K (2048 x 8)

File Size 414.65K  /  17 Page

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