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  preheating Datasheet PDF File

For preheating Found Datasheets File :: 3410    Search Time::3.5ms    
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    MLG0402Q0N5CT000 MLG0402Q0N3CT000 MLG0402Q0N7BT000 MLG0402Q0N6CT000 MLG0402Q27NHT000 MLG0402Q3N1BT000 MLG0402Q1N4ST000

TDK Electronics
Part No. MLG0402Q0N5CT000 MLG0402Q0N3CT000 MLG0402Q0N7BT000 MLG0402Q0N6CT000 MLG0402Q27NHT000 MLG0402Q3N1BT000 MLG0402Q1N4ST000
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the ra...
Description High Q type inductor for high-frequency circuits
   High Q type inductor for high-frequency circuits

File Size 176.87K  /  15 Page

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    VLS252010CX-100M-16 VLS252010CX-2R2M VLS252010CX-3R3M VLS252010CX-6R8M VLS252010CX-220M VLS252010CX-R47M

TDK Electronics
Part No. VLS252010CX-100M-16 VLS252010CX-2R2M VLS252010CX-3R3M VLS252010CX-6R8M VLS252010CX-220M VLS252010CX-R47M
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the ra...
Description Wound Ferrite

File Size 103.19K  /  9 Page

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    VLS201610CX-R47M VLS201610CX-R68M VLS201610CX-220M VLS201610CX-150M VLS201610CX-1R0M VLS201610CX-1R5M VLS201610CX-2R2M V

TDK Electronics
Part No. VLS201610CX-R47M VLS201610CX-R68M VLS201610CX-220M VLS201610CX-150M VLS201610CX-1R0M VLS201610CX-1R5M VLS201610CX-2R2M VLS201610CX-4R7M VLS201610CX-3R3M
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the ra...
Description Wound Ferrite

File Size 103.14K  /  9 Page

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    VLS252012ET-R47N

TDK Electronics
Part No. VLS252012ET-R47N
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the ra...
Description Wound Ferrite

File Size 129.79K  /  9 Page

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    VLS252008ET-R47N

TDK Electronics
Part No. VLS252008ET-R47N
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the ra...
Description Wound Ferrite

File Size 114.02K  /  9 Page

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    MBRS1100 MBRS1100T3

MOTOROLA INC
MOTOROLA[Motorola, Inc]
Part No. MBRS1100 MBRS1100T3
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description Schottky Power Rectifier(Surface Mount Power Package)

File Size 74.10K  /  4 Page

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    MMBD6050LT1 ON2082

MOTOROLA[Motorola, Inc]
Part No. MMBD6050LT1 ON2082
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description From old datasheet system
Switching Diode

File Size 76.02K  /  4 Page

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    MMBD770T1 MMBD110T1 MMBD330T1 MMDD110T1 ON2076 MMBD110T1-D

MOTOROLA[Motorola, Inc]
ONSEMI[ON Semiconductor]
Part No. MMBD770T1 MMBD110T1 MMBD330T1 MMDD110T1 ON2076 MMBD110T1-D
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description From old datasheet system
SCHOTTKY BARRLER DLODES
Schottky Barrier Diodes

File Size 153.70K  /  8 Page

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    MMBF0201 MMBF0201N

MOTOROLA[Motorola, Inc]
Part No. MMBF0201 MMBF0201N
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 178.83K  /  6 Page

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    MMBF0202PLT1 MMBF0202PL ON2091

MOTOROLA[Motorola, Inc]
Part No. MMBF0202PLT1 MMBF0202PL ON2091
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description From old datasheet system
P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET

File Size 190.27K  /  6 Page

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For preheating Found Datasheets File :: 3410    Search Time::3.5ms    
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