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SMD07 CM100 0LVEL ISL6265A MLL962A STA335BW BVXXXX TA124
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  sawn Datasheet PDF File

For sawn Found Datasheets File :: 795    Search Time::2.828ms    
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    MS763-A MS763-S

Intersema Sensoric SA
Part No. MS763-A MS763-S
OCR Text ...Hg Pressure Sensor 0.2 mm Pyrex sawn on b/f 300 mmHg Pressure Sensor sawn on b/f Art.-Nr. 76325022 76325221 The MS763 dice are supplied sawn on blue foil, mounted on plastic rings FACTORY CONTACTS Intersema Sensoric SA Ch. Chapons-de...
Description PRESSURE SENSOR DIE (0-300 mmHg)

File Size 228.99K  /  4 Page

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    PCF8564ACX9_1 PCF8564ACX9_B_1 PCF8564A PCF8564AU_10AA_1 PCF8564AU_10AB_1 PCF8564AU_5BB_1 PCF8564AU_5BD_1 PCF8564AU_5GB_1

PLX Technology, Inc.
NXP Semiconductors
Part No. PCF8564ACX9_1 PCF8564ACX9_B_1 PCF8564A PCF8564AU_10AA_1 PCF8564AU_10AB_1 PCF8564AU_5BB_1 PCF8564AU_5BD_1 PCF8564AU_5GB_1 PCF8564AU_5GE_1 PCF8564ACX9/1 PCF8564ACX9/B/1 PCF8564AU/10AA/1 PCF8564AU/5BD/1 PCF8564AU/5GB/1 PCF8564AU/5GE/1 PCF8564AU/10AB/1 PCF8564AU/5BB/1
OCR Text ...wn wafer; thickness 687 m wafer sawn on FFC; thickness 200 m unsawn wafer; thickness 280 m unsawn wafer; thickness 687 m wafer sawn on FFC; thickness 200 m wafer sawn on FFC; thickness 200 m; die with solder bumps tape and reel; thickness 2...
Description REAL TIME CLOCK, UUC9 DIE-9
Real time clock and calendar

File Size 198.23K  /  44 Page

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    AUIRG7CH80K6B-M

International Rectifier
Part No. AUIRG7CH80K6B-M
OCR Text ...pping options are offered. * Un-sawn wafer * Die in waffle pack (consult the IR Die Sales team for availability) * Die on film (consult the IR Die Sales team for availability) Tape and Reel is also available for some products. Please consul...
Description AUTOMOTIVE GRADE

File Size 87.29K  /  3 Page

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    SMS3927-099 SMS3928-099 SMS3926-099

Skyworks Solutions Inc.
Part No. SMS3927-099 SMS3928-099 SMS3926-099
OCR Text ...ky diodes supplied 100% tested, sawn, mounted on film frame Low cost Available lead (Pb)-free, RoHS-compliant, and Green 2 2 1 3 1 4 4 3 Description The Skyworks SMS392x-099 family of Si Schottky diodes are configured as...
Description Schottky Diode Quad Mixer Chips Supplied on Film Frame

File Size 255.63K  /  5 Page

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    MF3ICD21 MF3ICD41 MF3ICD81 MF3ICD2101DUD_04 MF3ICD4101DUD_04 MF3MOD2101DA4_04 MF3MOD4101DA4_04 MF3MOD8101DA4_04 MF3ICD81

NXP Semiconductors
Part No. MF3ICD21 MF3ICD41 MF3ICD81 MF3ICD2101DUD_04 MF3ICD4101DUD_04 MF3MOD2101DA4_04 MF3MOD4101DA4_04 MF3MOD8101DA4_04 MF3ICD8101DUD_04 MF3MOD8101DA4/04 MF3ICD2101DUD/04 MF3MOD4101DA4/04 MF3MOD2101DA4/04 MF3ICD4101DUD/04 MF3ICD8101DUD/04
OCR Text ...4 FFC Description 8 inch wafer (sawn; 120 m thickness, on film frame carrier; electronic fail die marking according to SECSII format); see Ref. 4, 8K EEPROM MF3ICD4101DUD/04 FFC 8 inch wafer (sawn; 120 m thickness, on film frame carrier; el...
Description MIFARE DESFire EV1 contactless multi-application IC

File Size 60.41K  /  15 Page

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    MF1ICS7001

NXP Semiconductors
Part No. MF1ICS7001
OCR Text sawn wafer on UV-tape addendum Rev. 3.1 -- 18 April 2007 101731 Product data sheet PUBLIC 1. General description The MF1 IC S70 01 is a contactless smart card IC designed for card IC coils following the MIFARE card IC coil design ...
Description Standard 4Kbyte card IC sawn wafer on UV-tape addendum

File Size 198.83K  /  7 Page

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    MS7801-A MS7801-A0.2 MS7801-D MS7801 MS7801-A-0.2

Intersema Sensoric SA
Part No. MS7801-A MS7801-A0.2 MS7801-D MS7801 MS7801-A-0.2
OCR Text ... Product 1 bar Pressure Sensors sawn on b/f 1 bar Pressure Sensors 0.2 mm Pyrex sawn on b/f 1 bar Pressure Sensors sawn on b/f Art.-Nr. 780125021 780125022 780125121 The MS7801 dice are supplied sawn on blue foil, mounted on plastic ring...
Description PRESSURE SENSOR DIE (0-1 BAR)

File Size 461.32K  /  4 Page

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    MS761-A MS761-A0.2 MS761-D

Intersema Sensoric SA
Part No. MS761-A MS761-A0.2 MS761-D
OCR Text ...oduct 1 bar Pressure Sensor Die sawn on b/f 1 bar Pressure Sensor Die 0.2 mm Pyrex sawn on b/f 1 bar Pressure Sensor Die sawn on b/f Art.-Nr. 76125021 76125022 76125121 The MS761 dice are supplied sawn on blue foil, mounted on plastic ri...
Description PRESSURE SENSOR DIE (0-1 BAR)

File Size 240.38K  /  4 Page

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    XRA00 XRA00-SBN18I XRA00-W4I

STMicroelectronics
ST Microelectronics
Part No. XRA00 XRA00-SBN18I XRA00-W4I
OCR Text ... SBN18I = 180m 15 m Bumped and sawn Inkless Wafer on 8-inch Frame Customer Code XXX = Given by STMicroelectronics REVISION HISTORY Table 3. Document Revision History Date 27-Aug-2003 13-Aug-2004 Version 1.0 2.0 First Issue Dipole inlay...
Description UHF, EPCglobal, Contactless Memory IC 96 bit ePC with Inventory and Kill Function
UHF/ EPCglobal/ Contactless Memory IC 96 bit ePC with Inventory and Kill Function
EEPROM (Electrically-Erasable PROM) - Datasheet Reference
From old datasheet system

File Size 93.13K  /  4 Page

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    INFINEON[Infineon Technologies AG]
Part No. Q67120-D C167CS-XC Q67120-C2200 Q67120-C2274 Q67120-C2275
OCR Text ...50 C -40 to +150 C Wafers Whole sawn sawn sawn The designation SAL-... conforms to the valid ProElectron specification. These devices were named SAA-... formerly. Note: The ordering codes for Mask-ROM versions are defined for each pro...
Description 16-Bit Single-Chip Microcontroller Bare Die Delivery

File Size 853.47K  /  24 Page

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