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AMD Inc
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Part No. |
AM29F016D AM29F016D-120DPC1 AM29F016D-120DTI1 AM29F016D-120DWC1 AM29F016D-120DGC1 AM29F016D-120DWI1
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OCR Text |
...k 180 die per 5 tray stack DG = gel-Pak(R) Die Tray 432 die per 6 tray stack DT = SurftapeTM (Tape and Reel) 2500 per 7-inch reel SPEED OPTION See Product Selector Guide and Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F016D Known Good ... |
Description |
55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3505 with Lead Free Packaging 55V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU3505 with Standard Packaging 80V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRF1312 with Standard Packaging EEPROM From old datasheet system 16 Mbit (2 M x 8-Bit)
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File Size |
126.13K /
11 Page |
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it Online |
Download Datasheet |
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Motorola
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Part No. |
MPX2200
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OCR Text |
...essure Differential
SILICONE gel DIE COAT WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT P2
DIE BOND
LEAD FRAME
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing di... |
Description |
MPX2200 200 kPa On-Chip Temperature Compensated and Calibrated Pressure Sensors 200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors
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File Size |
126.10K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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