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  sawn Datasheet PDF File

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    NXP Semiconductors N.V.
NXP[NXP Semiconductors]
Part No. MF1ICS2005W7D MF1ICS2005 MF1ICS2005U7D
OCR Text sawn bumped 120m wafer addendum Rev. 3.0 -- 18 July 2007 141130 Product data sheet PUBLIC 1. General description The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the "Mifare card IC coil design...
Description sawn bumped 120レm wafer addendum
sawn bumped 120μm wafer addendum

File Size 80.73K  /  7 Page

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    IRF[International Rectifier]
Part No. IRG4CC71KB
OCR Text ...s are offered as standard. * Un-sawn wafer * Die in waffle pack * Die on film Tape and Reel is also available for some products. Please consult your local IR sales office or email http:/ /die.irf.com for additional information. Please speci...
Description IRG4CC71KB IGBT Die in Wafer Form

File Size 75.92K  /  2 Page

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    EMMICRO[EM Microelectronic - MARIN SA]
Part No. H1344V47DLWS11 H1344 H1344V143DL8A H1344V143SO8A H1344V143SO8B H1344V38DL8A H1344V38DLWS11 H1344V40DL8A H1344V40DLWS11 H1344V41DL8A H1344V41DLWS11 H1344V47DL8A
OCR Text ...Capacitance Delivery Form Stick sawn wafer Stick sawn wafer Stick sawn wafer Stick sawn wafer Stick Stick Tape & Reel Alarm Output Transistor Pulse width (tw) Modulation (fA1) Period (T1) Frequency (FA) Cycle time (T2) Ver...
Description CMOS Circuit for Analog Quartz Clocks with Bipolar Stepping Motor Drive

File Size 209.59K  /  6 Page

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    INFINEON[Infineon Technologies AG]
Part No. SAK-C505CA-4RC SAK-C505CA-LC C505CA-4RC SAA-C505CA-4RC SAA-C505CA-LC
OCR Text ... Ordering Code TBD Wafers Whole/sawn Comments 8-bit microcontroller with Temperature range: -40 C to +125 C (max. operating frequency: 20 MHz with 50% duty cycle) 8-bit microcontroller with Temperature range: -40 C to +150 C (max. operating...
Description 8-Bit Microcontrollers - High temperature 8-Bit CMOS microcontroller (T=150°C ) with mask-programmable ROM, bare die, with CAN, (20 MHz)
8-bit Single-Chip Microcontroller (Bare Die Delivery)

File Size 320.02K  /  22 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

NXP Semiconductors
Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
OCR Text sawn wafer on UV-tape" Product Specification Revision 3.0 PUBLIC August 2004 Philips Semiconductors Philips Semiconductors Product Specification Rev. 3.0 August 2004 Bumped sawn wafer on UV-tape Standard Card IC MF1 IC S50 0...
Description Standard Card IC Specification “bumped sawn wafer on UV-tape”

File Size 31.48K  /  7 Page

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    T1170P-SD-F

Vishay Siliconix
Part No. T1170P-SD-F
OCR Text ... package form t1170p-sd-f wafer sawn on foil wi th disco frame moq: 23 500 pcs chip absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 60 v junction temperatu...
Description Silicon PIN Photodiode

File Size 96.77K  /  5 Page

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    XRAG2 XRAG2-W4I XRAG2-SBN18I

意法半导
STMicroelectronics
Part No. XRAG2 XRAG2-W4I XRAG2-SBN18I
OCR Text ...tion Unsawn unbumped wafers or sawn and bumped wafers August 2005 For further information contact your local STMicroelectronics sales office. Rev. 2 1/8 www.st.com 8 1 Summary description XRAG2 1 ...
Description UHF, EPCGLOBAL CLASS-1 GENERATION-2, CONTACTLESS MEMORY CHIP 432 BIT WITH MULTI-SESSION PROTOCOL, ANTI-COLLISION AND KILL FUNCTIONS

File Size 49.29K  /  8 Page

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