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  42377-0246 Datasheet PDF File

For 42377-0246 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0702461401 70246-1401

Molex Electronics Ltd.
Part No. 0702461401 70246-1401
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Coilcraft Inc

Part No. EPL6024-681MEB
Description General Purpose Inductor, 0.68uH, 20%, Ferrite-Core, 2524
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0702461402 70246-1402

Molex Electronics Ltd.
Part No. 0702461402 70246-1402
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Coilcraft Inc

Part No. EPL6024-681MEC
Description General Purpose Inductor, 0.68uH, 20%, Ferrite-Core, 2524
Tech specs    

Official Product Page

    0702461404 70246-1404

Molex Electronics Ltd.
Part No. 0702461404 70246-1404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin (Sn) PC TailPlating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin (Sn) PC TailPlating

File Size 176.00K  /  4 Page

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Coilcraft Inc

Part No. EPL6024-681
Description Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
Tech specs    

Official Product Page

    70246-0801 0702460801

Molex Electronics Ltd.
Part No. 70246-0801 0702460801
Description 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 175.76K  /  4 Page

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Coilcraft Inc

Part No. EPL6024-681ME
Description Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
Tech specs    

Official Product Page

    70246-0802 0702460802

Molex Electronics Ltd.
Part No. 70246-0802 0702460802
Description 2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 87024-610TRLF
Description Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 20 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    0702463001 70246-3001

Molex Electronics Ltd.
Part No. 0702463001 70246-3001
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 87024-630TRLF
Description Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 60 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    0702463004 70246-3004

Molex Electronics Ltd.
Part No. 0702463004 70246-3004
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 30Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

File Size 176.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-102-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0702461201

Molex Electronics Ltd.
Part No. 0702461201
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 12Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 98401-802-46LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 46 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0702461004 70246-1004

Molex Electronics Ltd.
Part No. 0702461004 70246-1004
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13渭m (5渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 176.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 87024-650
Description Rib-Cage® Board-To-Board, Surface Mount PCB Receptacle, 100 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    0702461002 70246-1002

Molex Electronics Ltd.
Part No. 0702461002 70246-1002
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 10Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 68602-462HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

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