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				Tyco Electronics
Part No.	MA4AGSW1A
OCR Text	...rical and thermal conductivity. cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 150C. RIBBON/WIRE BONDING Wedge thermo compression bonding or ball bonding may be used to attach gold ...
Description	AlGaAs SPST Non-Reflective PIN Diode Switch
File Size	240.22K / 15 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MA4AGSW8-1
OCR Text	...y and lower thermal resistance. cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 150 C. Electro-Static Sensitivity These Devices are considered ESD Class1. Proper ESD techniques shoul...
Description	AlGaAs SP8T PIN Diode Series Switch
File Size	152.16K / 7 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC519
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. These bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 18 - 32 GHz
File Size	306.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC520
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	282.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC521
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	280.40K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC522
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	277.61K / 6 Page	View it Online	Download Datasheet

For cure Found Datasheets File :: 792 Search Time::1.188ms
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