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				NXP Semiconductors Philips Semiconductors
Part No.	BYW97 BYW97F BYW97G BYW97_3
OCR Text	... BYW97 series Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) Fig.1 Simp...
Description	Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:30pF/ft; Conductor Material:Copper RoHS Compliant: Yes Fast soft-recovery controlled avalanche rectifiers From old datasheet system Sound/Security Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material
File Size	52.43K / 8 Page	View it Online	Download Datasheet

				Cypress Semiconductor
Part No.	CYIH1SM1000AA-HHCES CYIH1SM1000AA-HHCS
OCR Text	... the position of the die in the package. 1.9 Procurement Requirements The HAS2 image sensor can be procured at Cypress Semiconductor or ...glass window. Type Material Thermal expansion coefficient Hermeticity Thermal resistance (Junction t...
Description	Detailed Specification - ICD
File Size	1,398.51K / 71 Page	View it Online	Download Datasheet

				MICROSEMI CORP-SCOTTSDALE http:// MICROSEMI[Microsemi Corporation] MICROSEMI CORP-LAWRENCE
Part No.	MLL957B MLL960B MLL976B MLL983B MLL979B MLL992B MLL959B MLL958B MLL966B MLL961B MLL962B MLL963B MLL964B MLL965B MLL967B MLL968B MLL969B MLL970B MLL971B MLL972B MLL973B MLL974B MLL975B MLL977B MLL978B MLL980B MLL981B MLL982B MLL984B MLL985B MLL986B MLL987B MLL988B MLL989B MLL990B MLL991B MLL965B-1 MLL990B-1 MLL978B-1 MLL977B-1 MLL983B-1 MLL970B-1 MLL980B-1 MLL966B-1 MLL961B-1 MLL958B-1 MLL975B-1 MLL981B-1
OCR Text	... Features * * * * * Leadless Package For Surface Mount Technology Ideal For High Density Mounting Voltage Range 6.8 To 200 Volts Hermetically Sealed, Double Slug Glass Construction Metallurgically Bonded Construction Available as Dash On...
Description	surface mount silicon Zener diodes LEADLESS GLASS ZENER DIODE SURFACE MOUNT Zener Voltage Regulator Diode
File Size	70.98K / 3 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BYW95A BYW95C BYW95 BYW95B BYW95_1 BYW95A/30 BYW95B/20 BYW95B/33 BYW95C/20 BYW95C/24 BYW95C/40 BYW95A/A52R
OCR Text	...95 series Rugged glass SOD64 package, using a high temperature alloyed 2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL V...
Description	Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:30pF/ft; Conductor Material:Copper RoHS Compliant: Yes Fast soft-recovery controlled avalanche rectifiers From old datasheet system Sound/Security Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material 5.0 AMP POSITIVE VOLTAGE REGULATOR
File Size	54.75K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BYD12 BYD12M BYD12D BYD12G BYD12J BYD12K BYD12SERIES
OCR Text	...y free cylindrical glass SOD120 package through ImplotecTM(1) technology. This package is a MGL571 Fig.1 Simplified outline (SOD120) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMB...
Description	Controlled avalanche rectifiers 48-96 KBYTE ROM HCMOS MCU WITH ON-SCREEN DISPLAY AND TELETEXT DATA SLICER
File Size	48.99K / 8 Page	View it Online	Download Datasheet

				TOSHIBA
Part No.	TPCC8106
OCR Text	...atures features (1) small, thin package (2) low drain-source on-resistance: r ds(on) = 9.5 m ? (typ.) (v gs = -10 v) (3) low leakage curr...glass-epoxy board (a), figure 5.1 note 3: device mounted on a glass-epoxy board (b), figure 5.2 note...
Description	Power MOSFET (P-ch single)
File Size	235.38K / 9 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCA8088
OCR Text	...otprint due to a small and thin package (2) low drain-source on-resistance: r ds(on) = 1.7 m ? (typ.) (v gs = 10 v) (3) low leakage curre...glass-epoxy board (a), figure 5.1 note 3: device mounted on a glass-epoxy board (b), figure 5.2 note...
Description	MOSFETs Silicon N-Channel MOS (U-MOS)
File Size	229.96K / 9 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	1N4948 1N4942_04
OCR Text	...series where surface mount MELF package configurations are also available by adding a "US" suffix (see separate data sheet for 1N5615US thru...glass package Triple-Layer Passivation Internal "Category I" Metallurgical bonds Working Peak Revers...
Description	VOIDLESS-HERMETICALLY SEALED FAST RECOVERY GLASS RECTIFIERS
File Size	180.40K / 2 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TPCA8087
OCR Text	...otprint due to a small and thin package (2) low drain-source on-resistance: r ds(on) = 1.5 m ? (typ.) (v gs = 10 v) (3) low leakage curre...glass-epoxy board (a), figure 5.1 note 3: device mounted on a glass-epoxy board (b), figure 5.2 note...
Description	MOSFETs Silicon N-Channel MOS (U-MOS)
File Size	258.21K / 9 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	GBPC1506W GBPC15005W
OCR Text	...od 208 for the wire type gbpc-w package) - nickel for gbpc package. suffix ?w? ? wire lead stru...glass passivated) ? 2010 fairchild semiconductor corporation www.fairchildsemi.com gbpc 12, 15, 25...
Description	Bridge Rectifiers
File Size	154.19K / 7 Page	View it Online	Download Datasheet

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