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  preheating Datasheet PDF File

For preheating Found Datasheets File :: 3410    Search Time::3.719ms    
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    MLG0603P2N0BT000 MLG0603P4N0ST000 MLG0603P2N3BT000 MLG0603P2N3CT000 MLG0603P0N6BT000 MLG0603P47NHT000 MLG0603P68NJT000 M

TDK Electronics
Part No. MLG0603P2N0BT000 MLG0603P4N0ST000 MLG0603P2N3BT000 MLG0603P2N3CT000 MLG0603P0N6BT000 MLG0603P47NHT000 MLG0603P68NJT000 MLG0603P68NHT000 MLG0603P1N4ST000
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperatur e difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the r...
Description High Q type inductor for high-frequency circuits
   High Q type inductor for high-frequency circuits

File Size 264.82K  /  17 Page

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    MURB1620CT/D MURB1620CT-D

ON Semiconductor
Diodes, Inc.
Part No. MURB1620CT/D MURB1620CT-D
OCR Text ...ould be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, th...
Description SWITCHMODE Power Rectifier D2PAK Power Surface Mount Package
SWITCHMODE Power Rectifier 开关模式?电力整流

File Size 65.76K  /  8 Page

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    HF70ACB322513-T-15

TDK Electronics
Part No. HF70ACB322513-T-15
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the rang...
Description Chip Beads

File Size 99.33K  /  8 Page

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    HF70ACB453215-T-15

TDK Electronics
Part No. HF70ACB453215-T-15
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the rang...
Description Chip Beads

File Size 99.29K  /  8 Page

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    HF70ACB201209-T-15 HF30ACB201209-T HF50ACB201209-T HF30ACB201209-T-15 HF50ACB201209-T-15 HF30ACB201209T HF50ACB201209T

TDK Electronics
Part No. HF70ACB201209-T-15 HF30ACB201209-T HF50ACB201209-T HF30ACB201209-T-15 HF50ACB201209-T-15 HF30ACB201209T HF50ACB201209T
OCR Text ...sure to preheat components. the preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150c. soldering corrections after mounting should be within the rang...
Description Chip Beads
   Chip Beads

File Size 100.71K  /  8 Page

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    NTTD1P02R2-D NTTD1P02R2/D

ON Semiconductor
Part No. NTTD1P02R2-D NTTD1P02R2/D
OCR Text ...ould be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, th...
Description Power MOSFET -1.45 Amps-20 Volts
Power MOSFET -1.45 Amps, -20 Volts P-Channel Enhancement Mode Dual Micro8 Package

File Size 89.79K  /  8 Page

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    NTGS3443T1/D NTGS3443T1-D

ON Semiconductor
Part No. NTGS3443T1/D NTGS3443T1-D
OCR Text ...ould be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, th...
Description Power MOSFET 2 Amps, 20 Volts P-Channel TSOP-6
Receptacle With A Wire Wrap Tail

File Size 58.91K  /  8 Page

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    1PMT5920BT3-D 1PMT5920BT3/D

ON Semiconductor
Part No. 1PMT5920BT3-D 1PMT5920BT3/D
OCR Text ...should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, th...
Description 3.2瓦特塑料表面贴装POWERMITE?包
3.2 Watt Plastic Surface Mount POWERMITE Package

File Size 64.12K  /  8 Page

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    NTTD2P02R2-D NTTD2P02R2/D

ON Semiconductor
Part No. NTTD2P02R2-D NTTD2P02R2/D
OCR Text ...ould be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, th...
Description Power MOSFET -2.4 Amps-20 Volts
Power MOSFET -2.4 Amps, -20 Volts Dual P-Channel Micro8

File Size 84.03K  /  8 Page

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    BCP53T1-D

ON Semiconductor
Part No. BCP53T1-D
OCR Text ...0 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient should be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooli...
Description PNP Silicon Epitaxial Transistors

File Size 47.43K  /  4 Page

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For preheating Found Datasheets File :: 3410    Search Time::3.719ms    
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