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				Micro Analog systems
Part No.	MAS1017 MAS1017ATC1-1 MAS1017ATC1
OCR Text	...ss 400 m wafer thickness 400 m, sawn wafer, tape ring 6", non UV tape, tape not expanded Please contact Micro Analog Systems Oy for other wafer thickness, sawn wafer delivery as well as SMD package options. LOCAL DISTRIBUTOR MICRO ANA...
Description	AM RECEIVER IC
File Size	146.44K / 6 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	SMP1320-099 SMP1302-099 SMP1304-099
OCR Text	...IN diodes supplied 100% tested, sawn, mounted on film frame Low cost Available lead (Pb)-free, RoHS-compliant, and Green Description The SMP series of PIN diodes is designed for high-volume switch applications from 10 MHz to beyond ...
Description	PIN Diode Chips Supplied on Film Frame
File Size	240.01K / 5 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	SL1ICS3101W_N5D SL1ICS3101 SL1ICS3101U SL1ICS3101U_L6D SL1ICS3101U_N5D SL1ICS3101W
OCR Text	............. 13 10.2.2 Packing of sawn Wafers ................................................................................................ 13 July 2000 Page 2 of 22 Public Product Specification SL1 ICS31 01 Rev. 1.2 11 HAN...
Description	I.CODE1 Label IC 97pF Chip Specification
File Size	362.82K / 22 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7228-A
OCR Text	...solute 28 bar pressure sensors sawn on b /f 722825021 the ms7228 dice are supplied sawn on blue foil, mou nted on plastic rings factory contacts intersema sensoric sa ch. chapons-des-prs 11 ch-2022 bevaix switzerland ...
Description	PRESSURE SENSOR DIE (0-28 BAR) FOR HARSH ENVIRONMENT
File Size	224.02K / 4 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	SL1ICS3001 SL1ICS3001U SL1ICS3001U_L6D SL1ICS3001U_N5D SL1ICS3001W SL1ICS3001W_N5D
OCR Text	............. 13 10.2.2 Packing of sawn Wafers ................................................................................................ 13 SL040521.doc/M Public Page 2 of 22 I*CODE1 Chip Specification Rev. 2.1 May 2000 11 ...
Description	I.CODE1 Label IC Chip Specification
File Size	365.23K / 22 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	SL3ICS1002F7AF
OCR Text	...002fug/v7af wafer bumped die on sawn wafer - sl3s1002ftt tssop8 plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 sl3s1002ftb1 xson3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5...
Description	UCODE G2XM and G2XL
File Size	301.77K / 51 Page	View it Online	Download Datasheet

				EMMICRO[EM Microelectronic - MARIN SA]
Part No.	EM5060V2WP11 EM5060V1WS11 EM5060V2WS11 EM5060V1WP11 EM5060
OCR Text	... waffle pack, 11 mils thickness sawn wafer, 11 mils thickness Die in waffle pack, 11 mils thickness sawn wafer, 11 mils thickness EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circ...
Description	Low Voltage CMOS Driver Circuit 低电压的CMOS驱动电路
File Size	64.90K / 4 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	SMP1353-099 SMP1322-099 SMP1340-099
OCR Text	...IN diodes supplied 100% tested, sawn, mounted on film frame Low cost Available lead (Pb)-free, RoHS-compliant, and Green Description The SMP series of PIN diodes is designed for high-volume switch applications from 10 MHz to beyond ...
Description	PIN Diode Chips Supplied on Film Frame
File Size	184.38K / 5 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	CPWR0600S001
OCR Text	...marking cpwr-0600s001b al ni/ag sawn on foil wafer # on foil v rrm = 600 v i f(avg) = 1 a q c = 3.3 nc subject to change without notice. www.cree.com/power 2 cpwr-0600s001 rev. f electrical characteristics symbol para...
Description	Silicon Carbide Schottky Diode Chip
File Size	193.02K / 3 Page	View it Online	Download Datasheet

For sawn Found Datasheets File :: 646 Search Time::2.141ms
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