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				Hittite Microwave Corporation
Part No.	HMC523
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 15 - 23.6 GHz
File Size	299.96K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC524
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 22 - 32 GHz
File Size	275.56K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC525
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 4.0 - 8.5 GHz
File Size	285.04K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC526
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 6 - 10 GHz
File Size	272.71K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC527
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	267.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC528
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	267.84K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC553
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	240.25K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC554
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	257.00K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC555
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 31 - 38 GHz
File Size	290.11K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC556
OCR Text	...nce it is placed into position. cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C ...
Description	GaAs MMIC I/Q MIXER 36 - 41 GHz
File Size	281.15K / 6 Page	View it Online	Download Datasheet

For cure Found Datasheets File :: 800 Search Time::1.546ms
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