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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC341
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OCR Text |
... 7. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS.
Absolute Maximum Ratings
Drain Bias Voltage (Vdd) RF Input Power (RFin)(Vdd = +3.0 Vdc) Channel Temperature Continuous Pdiss (T = 85 C) (derate 3.44 mW/C above 85 C) Thermal Resistanc... |
Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 24 - 30 GHz GaAs MMIC LOW NOISE AMPLIFIER, 24 - 30 GHz
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File Size |
181.84K /
6 Page |
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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC342 -HMC342
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OCR Text |
... 7. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS.
Absolute Maximum Ratings
Drain Bias Voltage (Vdd) RF Input Power (RFin)(Vdd = +3.0 Vdc) Channel Temperature Continuous Pdiss (T = 85 C) (derate 3.62 mW/C above 85 C) Thermal Resistanc... |
Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 13 - 25 GHz GaAs MMIC LOW NOISE AMPLIFIER, 13 - 25 GHz
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File Size |
185.16K /
6 Page |
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it Online |
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美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC344
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OCR Text |
.... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS.
7 - 22
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order O... |
Description |
GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 8.0 GHz
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File Size |
163.87K /
6 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC448
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OCR Text |
.... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at w... |
Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT
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File Size |
222.03K /
6 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC449
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OCR Text |
.... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at w... |
Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT
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File Size |
221.78K /
6 Page |
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it Online |
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HITTITE[Hittite Microwave Corporation]
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Part No. |
HMC606
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OCR Text |
...] 2. NO CONNECTION REQUIRED FOR unlabeled BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD
For price, deliv... |
Description |
GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
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File Size |
385.85K /
6 Page |
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it Online |
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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-1000
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OCR Text |
.... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
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Description |
DC-20 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
124.94K /
4 Page |
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it Online |
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Price and Availability
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