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For unlabeled Found Datasheets File :: 409    Search Time::2.25ms    
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    HMC579

Hittite Microwave Corporation
Part No. HMC579
OCR Text .... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.h...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 32 - 46 GHz OUTPUT

File Size 242.49K  /  6 Page

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    STK14CA8 STK14CA8-RF45TR STK14CA8-NF25 STK14CA8-NF25I STK14CA8-NF25ITR STK14CA8-NF25TR STK14CA8-NF35 STK14CA8-NF35I STK1

SIMTEK[Simtek Corporation]
Part No. STK14CA8 STK14CA8-RF45TR STK14CA8-NF25 STK14CA8-NF25I STK14CA8-NF25ITR STK14CA8-NF25TR STK14CA8-NF35 STK14CA8-NF35I STK14CA8-NF35ITR STK14CA8-NF35TR STK14CA8-NF45 STK14CA8-NF45I STK14CA8-NF45ITR STK14CA8-NF45TR STK14CA8-RF25 STK14CA8-RF25I STK14CA8-RF25ITR STK14CA8-RF25TR STK14CA8-RF35 STK14CA8-RF35I STK14CA8-RF35ITR STK14CA8-RF35TR STK14CA8-RF45 STK14CA8-RF45I STK14CA8-RF45ITR
OCR Text ...latile storage elements. Ground unlabeled pins have no internal connections. VCAP VSS (Blank) Power Supply Power Supply No Connect Document Control #ML0022 Rev 1.5 February 2007 2 SSOP DQ0 A3 A2 A1 A0 DQ1 DQ2 1 2 3 4 5 ...
Description 128Kx8 Autostore nvSRAM

File Size 312.25K  /  19 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC341
OCR Text ... 7. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. Absolute Maximum Ratings Drain Bias Voltage (Vdd) RF Input Power (RFin)(Vdd = +3.0 Vdc) Channel Temperature Continuous Pdiss (T = 85 C) (derate 3.44 mW/C above 85 C) Thermal Resistanc...
Description GaAs MMIC LOW NOISE AMPLIFIER/ 24 - 30 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 24 - 30 GHz

File Size 181.84K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC342 -HMC342
OCR Text ... 7. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. Absolute Maximum Ratings Drain Bias Voltage (Vdd) RF Input Power (RFin)(Vdd = +3.0 Vdc) Channel Temperature Continuous Pdiss (T = 85 C) (derate 3.62 mW/C above 85 C) Thermal Resistanc...
Description GaAs MMIC LOW NOISE AMPLIFIER/ 13 - 25 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 13 - 25 GHz

File Size 185.16K  /  6 Page

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    美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
Part No. HMC344
OCR Text .... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS. 7 - 22 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order O...
Description GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 8.0 GHz

File Size 163.87K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC448
OCR Text .... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at w...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT

File Size 222.03K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC449
OCR Text .... 8. NO CONNECTION REQUIRED FOR unlabeled BOND PADS. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at w...
Description GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT

File Size 221.78K  /  6 Page

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    HITTITE[Hittite Microwave Corporation]
Part No. HMC606
OCR Text ...] 2. NO CONNECTION REQUIRED FOR unlabeled BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD For price, deliv...
Description GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz

File Size 385.85K  /  6 Page

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    SIMTEK[Simtek Corporation]
Part No. STK14D88-RF45TR STK14D88 STK14D88-NF25 STK14D88-NF25I STK14D88-NF25ITR STK14D88-NF25TR STK14D88-NF35 STK14D88-NF35I STK14D88-NF35ITR STK14D88-NF35TR STK14D88-NF45 STK14D88-NF45I STK14D88-NF45ITR STK14D88-NF45TR STK14D88-RF25 STK14D88-RF25I STK14D88-RF25ITR STK14D88-RF25TR STK14D88-RF35 STK14D88-RF35I STK14D88-RF35ITR STK14D88-RF35TR STK14D88-RF45 STK14D88-RF45I STK14D88-RF45ITR
OCR Text ...latile storage elements. Ground unlabeled pins have no internal connections. VCAP VSS (Blank) Power Supply Power Supply No Connect Document Control #ML0033 Rev 1.7 February 2007 2 STK14D88 ABSOLUTE MAXIMUM RATINGSa Voltage ...
Description 32Kx8 Autostore nvSRAM

File Size 293.07K  /  19 Page

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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SUF-1000
OCR Text .... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold. Device Assembly ...
Description DC-20 GHz, Cascadable pHEMT MMIC Amplifier

File Size 124.94K  /  4 Page

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For unlabeled Found Datasheets File :: 409    Search Time::2.25ms    
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