| PART |
Description |
Maker |
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P1BR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ILCX20-FJ0F18-20.000 ILCX20-FJ2F18-20.000 ILCX20-F |
4 Pad Ceramic Package Quartz Crystal, 1.2 mm x 1.6 mm
|
ILSI America LLC
|
| IL3Y-HX5F6.0-32.768 IL3Y-HX5F12.5-32.768 |
2 Pad Glass Package Quartz Crystal, 1.5 mm x 4.1 mm
|
ILSI America LLC
|
| ILCX04-GHD318-20.000 ILCX04-GHDF18-20.000 ILCX04-B |
4 Pad Ceramic Package, 5 mm x 7 mm
4 Pad Ceramic Package, 5 mm x 7 mm
|
ILSI America LLC
|
| ILCX19-JF0F18-20.000 ILCX19-JF1F18-20.000 ILCX19-J |
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
|
ILSI America LLC
|
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| HC49USM8-BI0F18-20.000 HC49USM8-BI1318-20.000 HC49 |
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
|
ILSI America LLC
|
| 18101RC MM58274CV |
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Pkg Converter
A cost-effective means of upgrading to a PLCC package type Clock Chip without changing your PCB layout
|
Aries Electronics, Inc.
|
| AD9238BCPZ-20 |
Dual 12-Bit, 20/40/65 MSPS, 3 V ADC; Package: LFCSP (9x9mm, 4.70mm exposed pad); No of Pins: 64; Temperature Range: Industrial 2-CH 12-BIT FLASH METHOD ADC, PARALLEL ACCESS, QCC64
|
Analog Devices, Inc.
|
