| PART |
Description |
Maker |
| SSB-COB6631GW |
66mm x 31mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565mm GREEN, 53 CHIPS, 4.2V 110mA
65mm x 31mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green,
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| SSB-COB15132GW |
151mm x 32mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 88 CHIPS, 565mm GREEN, 4.2V 440mA
151mm x 32mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
LUMEX INC.
List of Unclassifed Manufacturers
ETC
|
| SSB-COB6518GW |
65mm x 18mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT 565mm GREEN, 26CHIPS, 4.2V 130mA
65mm x 18mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green,
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| SSB-COB10114GW |
101mm x 14mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 32 CHIPS, 565mm GREEN, 4.2V 160mA
101mm x 14mm VIEW AREA, CHIP ON BOARD LED BACKLIGHT, 565NM green
|
List of Unclassifed Manufacturers
LUMEX INC.
ETC
|
| GWKAGHB2.EM |
Chip-on-Board
|
OSRAM GmbH
|
| GWKAGHB3.EM |
Chip-on-Board
|
OSRAM GmbH
|
| LCAS6-10-L-EB LCAS6-10-L |
VI CHIP Evaluation Board VI芯片评估
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| TLGD175 |
2 CHIP LED LAMP FOR MESSAGE BOARD
|
TOSHIBA[Toshiba Semiconductor]
|
| TB502-3X-520-XX |
Test Board for chip evaluation and Layout recommendations
|
PLL[PhaseLink Corporation]
|
| ZRB18AR61C106ME01 |
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
|
Murata Manufacturing Co...
|
| DF30FC-XXX DF30CJ-22DS DF30CJ-XXX DF30FB-20DP-0.4V |
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors 0.4 mm间距.9毫米高，板对板对FPC连接
0.4 mm Pitch, 0.9 mm Height, Board-to-Board / Board-to-FPC Connectors 0.4 mm间距0.9毫米高，板对板对FPC连接
PSE 27ANAF-RI00BL24-NO-L
FEU 5X20 CAP
|
HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
|
