| PART |
Description |
Maker |
| CPH-ETD29-1S-13P-17 CPH-ETD29-1S-13P-C CLI-ETD29-1 |
Coil former, termoplastic, horizontal
Dimensions for product: ETD29/16/10
|
Ferroxcube Internationa...
|
| EKI |
Aluminum Electrolytic Capacitors, Radial Style, Polarized AI Electrolytic Capacitor, High C-U Product with Miniature Dimensions, Little Leakage Current, Low Energy Requirement, Low Temp Range (-55°C / 105°C)
|
Vishay
|
| CPH-E16-8-5-1S-6P-Z |
Dimensions for product: E16/8/5
|
Ferroxcube Internationa...
|
| K9KAG08U0MPIB00 K9KAG08U0M-PCB0000 K9KAG08U0MPCK00 |
sheet of this product is either in preparation or is not effective yet. For more details about product specifications or technical files, please inquire through Contact us
|
Samsung semiconductor
|
| STP3NA100 STP3NA100FP |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN 老产品：不适合用于新设计中
N - CHANNEL ENHANCEMENT MODE FAST POWER MOS TRANSISTOR
|
ST Microelectronics
|
| S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| HCS12BFAMILYPP |
HCS12 B-Family Product Proposal
HCS12 B-Family Product Brief
|
Motorola
|
| SE7210TP1-E |
Intel庐 Server Board Technical Product Specification
Intel? Server Board Technical Product Specification
|
Intel Corporation
|
| NC316-144 NC316-288 NC316-72 |
Media Cross Connect垄芒 (MCC) Product Family
Media Cross Connect (MCC) Product Family
|
MRV Communications, Inc.
|
| S71WS512ND0BAWAN3 S71WS512ND0BAWAP0 S71WS256ND0BAW |
Stacked Multi-Chip Product (MCP)
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
|
http://
SPANSION[SPANSION]
Spansion, Inc.
|
