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E2D0082-29-93
Semiconductor MSM9836-xxx
Semiconductor Voice Synthesis IC with Built-in Mask ROM
This version: Sep. 1999 MSM9836-xxx Previous version: May. 1997
GENERAL DESCRIPTION
The MSM9836 is a PCM voice synthesis IC with built-in 3-Mbit mask ROM, D/A converter, and low-pass filter (LPF). The MSM9836 is specifically designed for applications that use a microcontroller. For this reason, functional support for standalone mode and RC oscillation has been omitted from the MSM9805, and the ROM capacity and the number of phrases have been increased. By using Oki's Sound Analysis and Editing Tool, ROM data such as Phrase Control Table can be easily set, created, edited, and evaluated. The following table lists the functional differences between the MSM9836 and the MSM9805.
MSM9836 ROM Capacity Interface Oscillation Maximum Number of Phrases Status Signal 3 Mbits Microcontroller Ceramic 127 NAR/BUSY simultaneous output MSM9805 2 Mbits Microcontroller/Standalone Ceramic/RC 63 Only NAR output when operating in microcontroller interface mode
FEATURES
* 8-bit OKI nonlinear PCM method/8-bit Straight PCM method * Sampling frequency : 4.0 kHz/5.3 kHz/6.4 kHz/8.0 kHz/10.6 kHz/12.8 kHz/ (Can be set for each phrase) 16.0 kHz * ROM capacity : 3 Mbits * Maximum playback time : 97.7 sec (fSAM = 4.0 kHz) 73.7 sec (fSAM = 5.3 kHz) 61.0 sec (fSAM = 6.4 kHz) 48.8 sec (fSAM = 8.0 kHz) * Master clock frequency : 4.096 MHz (Ceramic oscillation/external clock input) * Edit ROM function * Maximum number of phrases : 127 * Built-in current mode 10-bit D/A converter * Built-in low-pass filter * Power supply voltage : +2.0 to +5.5 V * Package : 24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSM9836-xxxGS-K) xxx indicates code number. Chip
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Semiconductor
BLOCK DIAGRAM
I6 I5 I4 I3 I2 I1 I0
Address Controller
7
19-Bit Multiplexer
3-Mbit ROM (Including 17 Kbits of Edit ROM & Address ROM) 8
DATA Controller TEST ST NAR BUSY 19-Bit Address Counter I/O Interface PCM Synthesizer
10
XT XT Crystal Circuit Timing Controller
10-Bit DAC & LPF
MSM9836-xxx
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EXTCK
RESET
VDD
GND
VREF
AOUT
Semiconductor
MSM9836-xxx
PIN CONFIGURATION (TOP VIEW)
VDD XT XT NC TEST BUSY EXTCK ST NC 1 2 3 4 5 6 7 8 9 24 AOUT 23 VREF 22 GND 21 NC 20 NAR 19 NC 18 I6 17 RESET 16 NC 15 I5 14 I4 13 I3
I0 10 I1 11 I2 12
NC : No connection 24-Pin Plastic SOP
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Semiconductor
MSM9836-xxx
PIN DESCRIPTIONS
Pin Symbol Type Description The IC enters the standby state if this pin is set to "L" level. At this time, oscillation 17 RESET I stops and AOUT output becomes GND level, then the IC returns to the initial state. Apply a "L" pulse upon power-on. This pin has an internal pull-up resistor. Signal output pin that indicates whether the 7-bit LATCH (see Block Diagram) is idle. 20 7 NAR EXTCK O I NAR at "H" level indicates that the LATCH is empty and ST input is enabled. Ceramic oscillator input/external clock input switching pin. Set to "H" level if ceramic oscillation is used. Set to "L" level if external clock is used. Volume setting pin. If this pin is set to GND level, the maximum current is forced in, 23 VREF I and if set to VDD level, the minimum current is forced in. An approx. 10 kW pull-down resistor is internally connected to this pin during operation. Voice output pin. 24 22 1 2 AOUT GND VDD XT O -- -- I The voice signals are output as current changes. A "L" level signal is output through this pin in standby state. Ground pin. Power supply pin. Insert a bypass capacitor of 0.1 mF or more between this pin and the GND pin. Ceramic oscillator connection pin when ceramic oscillation is selected. Input from this pin if external clock is used. Ceramic oscillator connection pin when ceramic oscillation is selected. 3 5 8
10-15, 18
XT TEST ST I0 - I6 BUSY
O I I I O
Leave this pin open if external clock is used. A "L" level signal is output through this pin in standby state. Normally leave this pin open. This pin is used only for testing the internal circuit. Voice synthesis starts at fall of ST, and addresses I0 to I6 are fetched at rise of ST. Input ST when NAR, the status signal, is at "H" level. This pin has internal pull-up resistor. Phrase input pins corresponding to playback sound. This pin is at "H" level after reset is input. A "L" level signal is output through this pin for the time during which voice is being played.
6
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Semiconductor
MSM9836-xxx
ABSOLUTE MAXIMUM RATINGS
(GND=0V) Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta=25C -- Rating -0.3 to +7.0 -0.3 to VDD + 0.3 -55 to +150 Unit V V C
RECOMMENDED OPERATING CONDITIONS
(GND=0 V) Parameter Power Supply Voltage Operating Temperature Original Oscillation Frequency Symbol VDD Top fOSC Condition -- -- When crystal is selected Min. 3.5 Range 2.0 to 5.5 -40 to +85 Typ. 4.096 Max. 4.5 Unit V C MHz
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(VDD=5.0 V, GND=0 V, Ta=-40 to +85C, unless otherwise specified) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "H" Input Current 1 "H" Input Current 2 "L" Input Current 1 "L" Input Current 2 (*1) Dynamic Supply Current 1 (*2) Dynamic Supply Current 2 (*3) Standby Current AOUT Output Current VREF Pin Pull-Down Resistance Symbol VIH VIL VOH VOL IIH1 IIH2 IIL1 IIL2 IDD1 IDD2 IDS IAOUT RVREF Condition -- -- IOH=-1 mA IOL=2 mA VIH=VDD Applies to XT pin only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT voltage=0V At maximum output current VREF=GND, AOUT voltage=0V Ta=-40 to +70C Ta=-40 to +85C At maximum output current VREF=VDD, AOUT voltage=0V -- Min. 4.2 -- 4.6 -- -- -- -10 -200 -- -- -- -- 6 7 Typ. -- -- -- -- -- -- -- -90 0.4 -- -- -- 9.5 10 Max. -- 0.8 -- 0.4 10 15 -- -30 1 16 10 50 15 13 Unit V V V V A A A A mA mA A A mA kW
*1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current
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Semiconductor DC Characteristics (2)
MSM9836-xxx
(VDD=3.1 V, GND=0 V, Ta=-40 to +85C, unless otherwise specified) Parameter "H" Input Voltage "L" Input Voltage "H" Output Voltage "L" Output Voltage "H" Input Current 1 "H" Input Current 2 "L" Input Current 1 "L" Input Current 2 (*1) Dynamic Supply Current 1 (*2) Dynamic Supply Current 2 (*3) Standby Current AOUT Output Current VREF Pin Pull-Down Resistance Symbol VIH VIL VOH VOL IIH1 IIH2 IIL1 IIL2 IDD1 IDD2 IDS IAOUT RVREF Condition -- -- IOH=-1 mA IOL=2 mA VIH=VDD Applies to XT pin only. VIH=VDD VIL=GND Internal pull-up resistor VREF=VDD, AOUT voltage=0V At maximum output current VREF=GND, AOUT voltage=0V Ta=-40 to +70C Ta=-40 to +85C At maximum output current VREF=VDD, AOUT voltage=0V -- Min. 2.7 -- 2.6 -- -- -- -10 -100 -- -- -- -- 1.4 7 Typ. -- -- -- -- -- -- -- -30 0.15 -- -- -- 3.2 10 Max. -- 0.5 -- 0.4 10 15 -- -10 0.5 5.5 5 20 5 13 Unit V V V V A A A A mA mA A A mA kW
*1 Applicable to RESET, ST *2 Dynamic supply current excluding DAC output current *3 Dynamic supply current at maximum output current
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Semiconductor AC Characteristics
MSM9836-xxx
(VDD=5.0 V, GND=0 V, fOSC=4.096 MHz, Ta=-40 to +85C) Parameter Master Clock Duty Cycle RESET Input Pulse Width RESET Input Time After Power-on ST Signal Setup Time ST Input Pulse Width The ST-ST Pulse Interval Data Setup Time Data Hold Time NAR Output Time 1 NAR Output Time 2 NAR Output Time 3 NAR Output Time 4 BUSY Output Time 1 BUSY Output Time 2 D/A Converter Change Time Standby Transition Time (at end of voice output) Silence Time Between Phrases Symbol fduty tw(RST) tD(RST) tSTP t(ST) tSS tDW tWD tSNS tNAA tNAB tNAC tSBS tBSYA tDAR, tDAF tSTB tBLN Condition -- -- -- At power-on -- Upon entering the stop code (*4) -- -- fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz fSAM=8 kHz -- -- fSAM=8 kHz (*4) (*4) (*4) (*4) (*4) (*4) (*4) Min. 40 10 0 1 0.35 40 1 1 -- 350 315 350 -- 350 60 200 350 Typ. 50 -- -- -- -- -- -- -- -- 375 440 375 -- 375 64 250 375 Max. 60 -- -- -- 2000 -- -- -- 10 400 500 500 10 400 68 300 500 Unit % s s s s s s s s s s s s s ms ms s
*4 Proportional to master the periods of oscillation frequency fOSC1 and fOSC2. The rated values show values when the standard master oscillation frequency is used.
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Semiconductor
MSM9836-xxx
TIMING DIAGRAMS
1. AC Characteristics at Power-On
VDDMin
RESET (I)
BUSY (O)
2. AC Characteristics in Standby Status and when the IC is Activated
I6 to I0 (I) ST ( I )
NAR (O) BUSY (O)
, ,,,,
VDD tD(RST) tW(RST) tSTP ST (I) NAR (O)
t(ST) tDW tWD tSNS tSBS tBSYA tNAA tDAR Voice playback tSTB Standby transtion time tDAF Oscillation start D/A converter change time
AOUT (O)
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Semiconductor
3. Playback Timing
I6 to I0 (I)
1st phrase address
2nd phrase address
3rd phrase address
ST ( I ) tNAC NAR (O) BUSY (O) tNAB tBSYA
AOUT (O)
tDAR
1st phrase playback
2nd phrase playback
3rd phrase playback
tBLN Oscillation start
The pins I6 to I0 are used to enter the address of a phrase subject to voice synthesis. Voice synthesis starts by entering the ST signal during addressing.
MSM9836-xxx
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MSM9836-xxx
4. Stop Code Input Timing
I6 to I0 (I) "0000000" tSS ST ( I ) NAR (O) BUSY (O) AOUT (O) Voice stop User phrase
When I6-I0 are set to "0000000" during voice playback (during the output of "L" level at the BUSY pin), and a ST signal is input, playback stops regardless of whether NAR is at "H" or "L" level and AOUT becomes 1/2 IAOUT. Stop code becomes valid at the falling edge of ST. The stop code does not initialize internal units but only stops playback. To initialize an internal register, use the RESET pin.
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Semiconductor 1. Sampling Frequency
MSM9836-xxx
As shown in Table 1.1, 7 sampling frequencies are available. A sampling frequency can be selected and assigned to each phrase in ROM data. Table 1.1 Sampling Frequency
Sampling Frequency At standard oscillation frequency 4.0 kHz 5.3 kHz 6.4 kHz 8.0 kHz 10.6 kHz 12.8 kHz 16.0 kHz fOSC1/1024 fOSC1/768 fOSC1/640 fOSC1/512 fOSC1/384 fOSC1/320 fOSC1/256 Frequency diving ratio
2. Recording/Playback Time Figure 2.1 below shows memory allocation of the on-chip Mask ROM. About 17 Kbits of data area is allocated for the Phrase Control Table, Phrase Data Control and Test Data. Therefore, actual data area for storing sound data equals the total Mask ROM capacity minus 17 Kbits.
Phrase Control Table Area
8K bit
Pharase Data Control Area Test Data Area
8K bit 1K bit
On-chip Mask ROM Capacity 3072K bit
User's Area
3055K bit
Figure 2.1 Memory Allocation of On-chip Mask ROM
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Semiconductor
MSM9836-xxx
The playback time is obtained by dividing the memory capacity by the bit rate. The playback time for 8-bit PCM algorithm is obrained by using the following equation.
Playback time [sec] = Memory capacity [bit] Bit rate [bps] = Memory capacity [bit] Sampling frequency [Hz] 8 [bit]
For example, if all phrases are stored in the MSM9836 at 8 kHz sampling frequency, the maximum playback time is as follows.
Playback time = (3072-17) 1024 [bit] 8000 [Hz] 8 [bit] = 48.8 [sec]
Table 2.1 Maximum playback time
Maximum playback time (sec) fSAM=4.0kHz fSAM=6.4kHz fSAM=8.0kHz fSAM=16.0kHz 97.7 61.0 48.8 24.4
Model MSM9836
ROM capacity 3M bit
User's area 3055K bit
3. Playback Method This IC provides two kinds of playback methods, non-linear PCM algorithm and straight PCM algorithm. When the 8-bit non-linear PCM algorithm is selected, sound quality can be improved because a resolution equivalent to 10-bit straight PCM is available around the waveform center. You can select either non-linear PCM algorithm or straight PCM algorithm for each phrase. Table 3.1 shows the relationship between playback methods and applicable sounds. It is recommended to evaluate the sound quality before actual use. Table 3.1 Relationship between playback methods and applicable sounds
Playback method 8-bit straight PCM algorithm Applicable sound BEEP tone, sound effects
8-bit non-linear PCM algorithm Human voice
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Semiconductor 4. Phrase Control Table
MSM9836-xxx
Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in succession by a single easy control operation like controlling a single regular phrase playback. Up to 8 combined phrases including a silence can be registered in a single address in the Phrase Control Table. Further, you can use the maximum memory space for data storage because it is not required to have the same phrase data. To show an example, let's assume that your application needs to speak two similar sentences, "It is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and "today". What you have to do is to prepare these common sound data, not in sentences but in words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and Figure 4.1 Multiple phrases can be played continuously merely by specifying a desired phrase using an X address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played, and when address"02" is specified, "It is rainy" is played. Phrase Control Table, a silence can be inserted without using the User's Area. Minimum time for silence Maximum time for silence Time unit for setting up silence 32 ms 4064 ms 32 ms
Table 4.1 Matrix of the Phrase Control Table
No. 1 2 3
***
X-Address (HEX) 01 02 03
***
Y-Address (Up to 8 phrases) [01] [02] Silence [10] [03] [01] [02] Silence [12] [03]
Sound Data It is (silence) fine today. It is (silence) rainy today.
***
[01] [02] [10] [21] [11] [12] [22] [03] It is fine becoming cloudy, rainy in some areas today.
126 127
7E 7F
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Semiconductor
MSM9836-xxx
Figure 4.1 Phrase Combination Matrix for Phrase Control Table
Phrase Control Table Area No. X-Address 1 2 3 4 5 6 7 8 9 01 02 03 04 05 06 07 08 09 Silence time setting (32ms n) 0 1 2 127 7F 127 Silence time 32 ms 64 ms 4064 ms Phrase Addigned 1 2 3 4 5 6 7 8 [01] [02] [12] [03] -- -- -- it is rainy today
Phrase Data Registration Area No. Y-Address 1 2 3 16 17 18 19 32 33 34 01 02 03 10 11 12 13 20 21 22 Phrase it is today fine cloudy rainy snowy occasionally becoming in some areas
Silence (64ms)
127
7F
--
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Semiconductor 5. Oscillation and Clock Input 5. 1 Ceramic oscillation Figure 2 shows an external circuit using a ceramic oscillator.
MSM9836-xxx
Pull this pin to "H" level EXTCK XT XT
C1
C2
Figure 2 External Circuit Using a Ceramic Oscillator
For example, the following table shows the optimum load capacitances, power supply voltage ranges, and operating temperature ranges when ceramic oscillators made by Murata MFG Co., Ltd., and TDK Co., Ltd. are used.
Ceramic oscillator Maker
Murata MFG.
Optimal load capacity C1 (pF) 30 Built in Built in C2 (pF) 30 Built in Built in
Type CSA4.09MGU CST4.09MGWU CCR4.00MC3
Frequency (MHz) 4.09 4.09 4.0
supply voltage range (V) 2.0 to 5.5
Operating temperature range (C)
-40 to +85 2.0 to 5.5 2.4 to 5.5 -40 to +85
(Note)
TDK
When a 4 MHz ceramic oscillator is used, the playback speed of MSM9802/03/05 is slower by 2 percent than that of an analysis tool or a demonstration board.
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Semiconductor 5. 2 External clock input Figure 3 shows a circuit for external clock input.
EXTCK XT XT Open
MSM9836-xxx
Pull this pin to "L" level
External oscillation circuit
Figure 3 Circuit for External Clock Input
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Semiconductor 6. Low-Pass Filter
MSM9836-xxx
In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 4 and Table 4 show the LPF frequency characteristics and LPF cutoff frequency respectively. Only the voice output through LPF is enabled in this IC.
[dB] 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 10 100 1k 10k [Hz]
Figure 4 LPF Frequency Characteristics (fSAM=8 kHz)
Table 4 LPF Cutoff Frequency
Sampling Frequency (kHz) (fSAM) 4.0 5.3 6.4 8.0 10.6 12.8 16.0 Cutoff Frequency (kHz) (fCUT) 1.2 1.6 2.0 2.5 3.2 4.0 5.0
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Semiconductor 7. Standby Transition
MSM9836-xxx
When playback of a phrase is finished, if playback of the next phrase does not start up within tSTB (0.25 sec. typ.), the IC enters standby status and the entire operation stops.
I5-I0
ST NAR BUSY AOUT
Figure 5 Voice Playback Timing during D/A Converter Change Time If playback is attempted during D/A converter change time as shown in Figure 5, the IC exits from standby status and the output from the D/A converter begins going to the 1/2 IAOUT level. When the output reaches 1/2 IAOUT, voice playback starts.
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Semiconductor 8. Voice Output Unit Equivalent Circuit (AOUT, FREF Pins)
MSM9836-xxx
Current-Sourcing Type D/A Converter VREF 10kW (TYP) PCM Value
VDD
AOUT IAOUT
Standby Signal
(The above switch positions show those when the circuit is active.)
Figure 8.1 Voice Output Unit Equivalent Circuit
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Semiconductor
MSM9836-xxx
D/A CONVERTER OUTPUT CURRENT CHARACTERISTICS
Power Supply Voltage vs. Output Current Characteristics (Ta=25C, VAOUT=0V)
AOUT Output Current [mA]
14 12 10 8 6 4 2 0 0 1 2 3 4 5 6
Power Supply Voltage [V]
Temperature vs. Output Current Characteristics (VDD=5V, VAOUT=0V)
AOUT Output Current [mA]
14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100
Ambient Temperature Ta [C]
VREF Voltage vs. Output Current Characteristics (Ta=25C, VDD=5V, VAOUT=0V)
10
AOUT Output Current [mA]
8 6 4 2 0 0.0
0.5
1.0
1.5
2.0
2.5 VREF [V]
3.0
3.5
4.0
4.5
5.0
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Semiconductor APPLICATION CIRCUIT
MSM9836-xxx
MSM9836-xxx
MSC1157 (Speaker drive amplifier)
VDD I6 I5 I4 I3 I2 I1 I0 ST RESET BUSY NAR VREF
MCU
VCC AOUT AIN SP SP EXTCK XT GND XT STBY GND VR
+ -
TEST
SEL
+ -
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Semiconductor
MSM9836-xxx
PAD CONFIGURATION
Pad Layout Chip size Chip thickness Pad size Substrate potential X=7.65mm Y=3.32mm 350mm30mm 110mm110mm GND
Chip and pad number
Y-axis 16 17 18 12 19 11 X-axis 1 2 3 4 5 6 7 10 9 8 (NC) MSM9836 15 14 13
Pad coordinates (Chip center is located at X=0 and Y=0)
(Unit: mm) PAD No. 1 2 3 4 5 6 7 8 9 10 PAD Name VDD XT XT TEST BUSY EXTCK ST I0 I1 I2 X-axis -3620 -3623 -3623 -1932 -1044 1163 2234 3673 3673 3673 Y-axis -452 -742 -1349 -1460 -1455 -1453 -1455 -1432 -754 -312 PAD No. 11 12 13 14 15 16 17 18 19 PAD Name I3 I4 I5 RESET I6 NAR GND VREF AOUT X-axis 3673 3673 3673 1778 1260 -2443 -3665 -3623 -3623 Y-axis 415 816 1460 1460 1458 1460 1460 1136 585
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MSM9836-xxx
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.58 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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E2Y0002-29-62
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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