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| SS8117G 1A Adjustable Low-Dropout Regulator FEATURES Dropout voltage typically 1.2V @ I O = 800mA Output current in excess of 1A Adjustable output voltage Space-saving SOT-223 package Internal short circuit current limit Internal over temperature protection DESCRIPTION The SS8117G is a low dropout linear regulator with a max. dropout voltage of 1.4V at a load current of 1A. Available only in adjustable form, the output voltage can be set from 1.25V to 5V with only two e xternal resistors. The SS8117G provides over-temperature and overcurrent protection circuits to prevent it from being damaged by abnormal operating conditions. The SS8117G is available in a SOT-223 package. A tantalum electrolytic capacitor of at least 10F is required at the output to improve the transient response and stability. APPLICATIONS Post-regulation for switching DC/DC converters. High-efficiency linear regulator Battery charger Battery-powered instrumentation Motherboards ORDERING INFORMATION SS8117GT63XX Packing Pin Option Package Type PACKAGE TYPE GT6 : SOT-223 Pb-free PIN OPTION 1 3 : GND/ADJ 2 Vout 3 Vin PACKING TR : Tape & Reel TB: Tubes Pb-free, RoHS compliant TYPICAL APPLICATION PIN CONFIGURATION SS8117G VIN VIN VOUT GND/ADJ C1 1 F R1 R2 IO VOUT Top View COUT 10F 1 2 3 SOT 223 5/26/2005 Rev.2.2 www.SiliconStandard.com 1 of 6 SS8117G ABSOLUTE MAXIMUM RATINGS (Note 1) Input Voltage..........................................................................................................7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.................................................................................150C Storage Temperature Range.................................................................................-65C TJ +150C Reflow Temperature (soldering, 10secs) SOT 223 Pac kage................................................................................................260C Continuous Power Dissipation (TA = +25C) SOT 223(1) ...........................................................................................................0.8W Note (1): See Recommended Minimum Footprint OPERATING CONDITIONS (Note 1) (V IN-VADJ) Voltage.................................................................................................2.5V~6.5V Temperature Range.............................................................................................-40C T J 85C ELECTRICAL CHARACTERISTICS Operating Conditions: V IN 6.5V, TJ = 25C unless otherwise specified. [Note3] PARAMETER Reference Voltage Line Regulation Load Regulation Dropout Voltage Current Limit Adjust Pin Current Change Minimum Load Current Quiescent Current Ripple Rejection Thermal Regulation Temperature Stability RMS Output Noise (% of V OUT ) CONDITIONS V IN - V OUT = 2V, IOUT = 10mA (V OUT + 1.5V) < V IN < 6.5V, IOUT = 10mA (V IN - V OUT ) = 2V, 10mA < IOUT < 800mA V OUT = 2%, IOUT = 800mA V OUT = 2%, IOUT = 1A (V IN - V OUT ) = 2V V IN - V OUT = 2V, 10mA < IOUT < 1mA 1.5V < (V IN - V OUT ) < 5.25V V IN - V OUT = 2V f = 120Hz, COUT = 10F Tantalum, (V IN - V OUT ) = 3V, IOUT = 800mA TA = 25C, 30ms pulse V IN = 4V, IO =10mA TA = 25C, 10Hz < f < 10kHz, ILOAD = 10mA MIN 1.225 TYP 1.250 1.32 0.04 1.2 1.3 MAX 1.275 UNITS V % % 1.3 1.4 V V mA A mA A dB 1000 10 1200 0.15 80 50 0.004 0.3 0.007 156 150 10 0.02 %/W % % C/W C C Thermal Resistance,Junction-to-Ambient SOT-223; Recommended Minimum Footprint (No heat sink; No air flow) Thermal Shutdown Thermal Shutdown Hysteresis Junction Temperature Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resis tance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te mperature is Tjmax-TA / JA. If this dissipation is exceeded, the die temperature will rise above 150C and the IC will go into thermal shutdown. For the SS8117G in SOT 223 package, JA is 156C/W (See recommended minimum footprint). For safe operation in SOT 223 package, see "Typical Performance Characte ristics" (Safe Operating Area). Note3: Low duty cycle pulse techniques are used during test to maintain junction te mperature as close to ambient temperature as possible. Note4: The output capacitor should be tantalum or aluminum . 5/26/2005 Rev.2.2 www.SiliconStandard.com 2 of 6 SS8117G DEFINITIONS Output Voltage The SS8117G provides an adjustable output voltage from 1.25V to 5V with two external resistors. It can be calculated from: VOUT = 1.25V x voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly a ffected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation with which the regulator will still operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. (1+ R2 ) + IADJ x R2 1 R IADJ = 80A (typ.) Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 20% below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input volt- Recommended Minimum Footprint 5/26/2005 Rev.2.2 www.SiliconStandard.com 3 of 6 SS8117G TYPICAL PERFORMANCE CHARACTERISTICS (V IN= 4V, CIN=10F, COUT=10F, TA=25C, unless otherwise noted. Line transient Load Transient Dropout Voltage vs. Load Current 1.06 1.04 Dropout Voutput (V) 1.02 1 0.98 0.96 0.94 0.92 0.9 0 200 400 600 800 Output Current (mA) 1000 -45C IADJ Current(mA) 85C 25C 94 91 88 85 82 79 76 73 70 0 I ADJ Current vs. Load Current 85C 25C -45C 100 200 300 400 500 600 700 800 Load Current(mA) Ripple Rejection 60 IOUT = 100mA (VIN - V OUT) > 3V 40 IOUT = 800mA 30 20 10 0 10 100 1000 10000 Frequency (Hz) 100000 COUT = 10F IOUT = 0.1A~0.8A Output Voltage Change 50 Ripple Rejection (dB) 0.5 1 Temperature Stability 0 -0.5 -1 -40 -20 0 20 40 60 Temperature 80 100 5/26/2005 Rev.2.2 www.SiliconStandard.com 4 of 6 SS8117G TYPICAL PERFORMANCE CHARACTERISTICS (continued) Output Noise 1.60 VIN = 4.5V IOUT = 10mA 1.50 Short-Circuit current (A) 1.40 1.30 Short-Circuit Current 115C 25C 1.20 1.10 1.00 0.90 0.80 1.25 1.75 2.25 2.75 3.25 3.75 4.25 4.75 5.25 -45C (VIN-V OUT ) Diffrential (V) Load Regulation 0.15 Output Voltage Deviation (%) Overcurrent Protection Characteristics 0.1 0.05 0 -0.05 -0.1 -40 -25 -10 5 20 35 50 65 80 95 110 Temperature Max. Power Dissipation vs. PCB Top Copper Area 2.5 TAMB = 25C ; Still Air Max. Power Dissipationj vs. Ambient Temperature 2.5 2.3 Max. Dissipation Power (W) 2.1 1.9 1.7 1.5 1.3 1.1 0.9 0.7 still air; Different PCB Top Copper Area Unit : in 2 A=0.1 A=0.2 A=0.3 A=0.4 A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 Max. Dissipation Power (W) 2 1.5 1 0.5 0 0 1 2 3 4 PCB Top Copper Area (in2) 5 0.5 25 35 45 55 TAMB 65 (C) 75 85 5/26/2005 Rev.2.2 www.SiliconStandard.com 5 of 6 SS8117G A D B1 C 1 3(4X ) H E L e e1 L2 13 (4X) A1 B Feed Direction SOT 223 Package Orientation SOT-223 (GT6) Package SYMBOLS A A1 B B1 C D E e e1 H L L2 a 0 6.70 0.90 MIN 0.06 BSC 10 0 MILLIMETERS MIN 1.55 0.02 0.60 2.90 0.24 6.30 3.30 2.30 BSC 4.60 BSC 7.30 0.264 INCHES MAX 1.80 0.12 0.80 3.10 0.32 6.70 3.70 MIN 0.061 0.0008 0.024 0.114 0.009 0.248 0.130 0.090 BSC 0.181 BSC MAX 0.071 0.0047 0.031 0.122 0.013 0.264 0.146 0.287 0.036 MIN 0.0024 BSC 10 Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 5/26/2005 Rev.2.2 www.SiliconStandard.com 6 of 6 |
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