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PHK5NQ15T N-channel TrenchMOS standard level FET Rev. 02 -- 4 March 2010 Product data sheet 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 Features and benefits Low conduction losses due to low on-state resistance 1.3 Applications DC-to-DC convertors switching General purpose switching 1.4 Quick reference data Table 1. VDS ID Ptot Quick reference Conditions Tsp = 25 C; VGS = 10 V; see Figure 1 and 3 Tsp = 25 C; see Figure 2 Min Typ Max 150 5 6.25 Unit V A W drain-source voltage Tj 25 C; Tj 150 C drain current total power dissipation gate-drain charge Symbol Parameter Dynamic characteristics QGD VGS = 10 V; ID = 5 A; VDS = 75 V; Tj = 25 C; see Figure 11 VGS = 10 V; ID = 5 A; Tj = 25 C; see Figure 9 and 10 12 nC Static characteristics RDSon drain-source on-state resistance 56 75 m NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 2. Pinning information Table 2. Pin 1 2 3 4 5 6 7 8 S S S G D D D D Pinning information Symbol Description source source source gate drain drain drain drain 1 4 mbb076 Simplified outline 8 5 Graphic symbol D G S SOT96-1 (SO8) 3. Ordering information Table 3. Ordering information Package Name PHK5NQ15T SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number 4. Limiting values Table 4. Symbol VDS VDGR VGS ID IDM Ptot Tstg Tj IS ISM Limiting values Parameter drain-source voltage drain-gate voltage gate-source voltage drain current peak drain current total power dissipation storage temperature junction temperature source current peak source current Tsp = 25 C Tsp = 25 C; tp 10 s; pulsed Tsp = 100 C; VGS = 10 V; see Figure 1 Tsp = 25 C; VGS = 10 V; see Figure 1 and 3 Tsp = 25 C; tp 10 s; pulsed; see Figure 3 Tsp = 25 C; see Figure 2 Conditions Tj 25 C; Tj 150 C Tj 25 C; Tj 150 C; RGS = 20 k Min -20 -55 -55 Max 150 150 20 3.23 5 20 6.25 150 150 5 20 Unit V V V A A A W C C A A In accordance with the Absolute Maximum Rating System (IEC 60134). Source-drain diode PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 2 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 120 Ider (%) 80 03aa25 120 Pder (%) 80 03aa17 40 40 0 0 50 100 150 Tsp (C) 200 0 0 50 100 150 Tsp (C) 200 Fig 1. Normalized continuous drain current as a function of solder point temperature Fig 2. Normalized total power dissipation as a function of solder point temperature 003aaa242 102 ID (A) 10 tp = 10 s 1 ms 1 10 ms DC 10-1 100 ms Limit RDSon = VDS/ID 10-2 10-1 1 10 102 VDS (V) 103 Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 3 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 5. Thermal characteristics Table 5. Symbol Rth(j-sp) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to solder point thermal resistance from junction to ambient Conditions see Figure 4 minimum footprint; mounted on printed-circuit board Min Typ 70 Max 20 Unit K/W K/W 102 Zth(j-sp) (K/W) 10 = 0.5 0.2 0.1 0.05 1 0.02 P 003aaa243 single pulse 10-1 = tp T tp T t 10-2 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 4 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 6. Characteristics Table 6. Symbol V(BR)DSS VGS(th) Characteristics Parameter Conditions Min 134 150 1.2 2 Typ 3 10 10 129 60 56 Max 4.5 4 1 100 100 100 173 80 75 Unit V V V V V A A nA nA m m m Static characteristics drain-source breakdown ID = 250 A; VGS = 0 V; Tj = -55 C voltage ID = 250 A; VGS = 0 V; Tj = 25 C gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = -55 C; see Figure 8 ID = 1 mA; VDS = VGS; Tj = 150 C; see Figure 8 ID = 1 mA; VDS = VGS; Tj = 25 C; see Figure 8 IDSS IGSS RDSon drain leakage current gate leakage current drain-source on-state resistance VDS = 120 V; VGS = 0 V; Tj = 25 C VDS = 120 V; VGS = 0 V; Tj = 150 C VGS = 10 V; VDS = 0 V; Tj = 25 C VGS = -10 V; VDS = 0 V; Tj = 25 C VGS = 10 V; ID = 5 A; Tj = 150 C; see Figure 9 and 10 VGS = 5 V; ID = 3 A; Tj = 25 C VGS = 10 V; ID = 5 A; Tj = 25 C; see Figure 9 and 10 Dynamic characteristics QG(tot) QGS QGD Ciss Coss Crss td(on) tr td(off) tf VSD trr Qr total gate charge gate-source charge gate-drain charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time source-drain voltage reverse recovery time recovered charge IS = 5 A; VGS = 0 V; Tj = 25 C; see Figure 13 IS = 5 A; dIS/dt = -100 A/s; VGS = 0 V; VDS = 90 V; Tj = 25 C VDS = 75 V; RL = 15 ; VGS = 10 V; RG(ext) = 6 ; Tj = 25 C; ID = 5 A VDS = 25 V; VGS = 0 V; f = 1 MHz; Tj = 25 C; see Figure 12 ID = 5 A; VDS = 75 V; VGS = 10 V; Tj = 25 C; see Figure 11 29 3 12 1150 187 61 12 12 35 18 0.8 87 162 1.2 nC nC nC pF pF pF ns ns ns ns V ns nC Source-drain diode PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 5 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 4 ID (A) 3 003aaa244 10 V 3.8 V 8 ID (A) 6 003aaa245 VGS = 3.6 V 2 3.4 V 4 Tj = 150 C 25 C 1 3.2 V 3.0 V 0 0 0.5 1 1.5 VDS (V) 2 2 0 2 3 VGS (V) 4 Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values 03aa35 Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values 5 03aa32 10-1 ID (A) 10-2 min typ max VGS(th) (V) 4 max 10-3 3 typ 10-4 2 min 10-5 1 10-6 0 2 4 VGS (V) 6 0 -60 0 60 120 Tj (C) 180 Fig 7. Sub-threshold drain current as a function of gate-source voltage Fig 8. Gate-source threshold voltage as a function of junction temperature PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 6 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 200 RDSon (m) 3.4 V 150 3.6 V 003aaa246 3 a 03al51 3.8 V 2 100 VGS = 5 V 50 10 V 1 0 0 2 4 6 ID (A) 8 0 -75 -25 25 75 125 Tj (C) 175 Fig 9. Drain-source on-state resistance as a function of drain current; typical values 10 003aaa249 Fig 10. Normalized drain-source on-state resistance factor as a function of junction temperature 104 C (pF) 103 Ciss 003aaa248 VGS (V) 8 6 4 102 Coss Crss 2 0 0 10 20 QG (nC) 30 10 10-1 1 10 VDS (V) 102 Fig 11. Gate-source voltage as a function of gate charge; typical values Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 7 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 4 IS (A) 3 003aaa247 150 C 2 Tj = 25 C 1 0 0 0.2 0.4 0.6 0.8 1 VSD (V) Fig 13. Source current as a function of source-drain voltage; typical values PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 8 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 7. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE vMA Z 8 5 Q A2 A1 pin 1 index Lp 1 4 (A 3) A L wM detail X e bp 0 2.5 scale 5 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012 o 0.010 0.057 0.004 0.049 0.019 0.0100 0.014 0.0075 0.244 0.039 0.028 0.041 0.228 0.016 0.024 8 o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 14. Package outline SOT96-1 (SO8) PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 9 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 8. Revision history Table 7. Revision history Release date 20100304 Data sheet status Product data sheet Change notice Supersedes PHK5NQ15T-01 Document ID PHK5NQ15T_2 Modifications: * * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data - PHK5NQ15T-01 20030120 PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 10 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 9. Legal information 9.1 Data sheet status Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Document status [1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 9.3 Disclaimers Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 11 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS -- is a trademark of NXP B.V. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PHK5NQ15T_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 -- 4 March 2010 12 of 13 NXP Semiconductors PHK5NQ15T N-channel TrenchMOS standard level FET 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 Thermal characteristics . . . . . . . . . . . . . . . . . . .4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Contact information. . . . . . . . . . . . . . . . . . . . . .12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 March 2010 Document identifier: PHK5NQ15T_2 |
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