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| IPP048N12N3 G OptiMOSTM3 Power-Transistor Features * N-channel, normal level * Excellent gate charge x R DS(on) product (FOM) * Very low on-resistance R DS(on) * 175 C operating temperature * Pb-free lead plating; RoHS compliant * Qualified according to JEDEC1) for target application Product Summary V DS R DS(on),max ID 120 4.8 100 V m A PG-TO220-3 * Ideal for high-frequency switching and synchronous rectification * Halogen-free according to IEC61249-2-21 Type IPP048N12N3 G Package PG-TO220-3 Marking 048N12N Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol Conditions ID T C=25 C2) T C=100 C Pulsed drain current3) Avalanche energy, single pulse Reverse diode dv /dt Gate source voltage 4) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS dv /dt V GS P tot T j, T stg T C=25 C T C=25 C I D=100 A, R GS=25 I D=100 A, V DS=80 V, di /dt =100 A/s, T j,max=175 C Value 100 100 400 740 6 20 300 -55 ... 175 55/175/56 mJ kV/s V W C Unit A Rev. 2.1 page 1 2010-07-01 IPP048N12N3 G Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient R thJC R thJA minimal footprint 6 cm2 cooling area5) 0.5 62 40 K/W Values typ. max. Unit Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D=1 mA V GS(th) I DSS V DS=V GS, I D=230 A V DS=120 V, V GS=0 V, T j=25 C V DS=120 V, V GS=0 V, T j=125 C Gate-source leakage current Drain-source on-state resistance Gate resistance Transconductance I GSS R DS(on) RG g fs |V DS|>2|I D|R DS(on)max, I D=100 A V GS=20 V, V DS=0 V V GS=10 V, I D=100 A 120 2 3 0.1 4 1 A V 81 10 1 4.1 1.8 162 100 100 4.8 nA m S 1) J-STD20 and JESD22 Current is limited by bondwire; with an R thJC=0.5 K/W the chip is able to carry 161 A. See figure 3 Tjmax=150 C and duty cycle D=0.01 for Vgs<-5V 2) 3) 4) 5) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 2.1 page 2 2010-07-01 IPP048N12N3 G Parameter Symbol Conditions min. Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics 6) Gate to source charge Gate to drain charge Switching charge Gate charge total Gate plateau voltage Output charge Reverse Diode Diode continous forward current Diode pulse current Diode forward voltage Reverse recovery time Reverse recovery charge 6) Values typ. max. Unit C iss C oss C rss t d(on) tr t d(off) tf V DD=60 V, V GS=10 V, I D=50 A, R G=1.6 V GS=0 V, V DS=60 V, f =1 MHz - 9030 1150 54 31 55 64 19 12000 pF 1530 81 ns Q gs Q gd Q sw Qg V plateau Q oss V DD=60 V, V GS=0 V V DD=60 V, I D=100 A, V GS=0 to 10 V - 46 33 52 137 5.1 158 182 210 nC V nC IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=100 A, T j=25 C V R=60 V, I F=I S, di F/dt =100 A/s - 1.0 113 315 100 400 1.2 A V ns nC See figure 16 for gate charge parameter definition Rev. 2.1 page 3 2010-07-01 IPP048N12N3 G 1 Power dissipation P tot=f(T C) 2 Drain current I D=f(T C); V GS10 V 350 120 300 100 250 80 P tot [W] 200 I D [A] 150 100 50 0 0 50 100 150 200 60 40 20 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D=f(V DS); T C=25 C; D =0 parameter: t p 103 limited by on-state resistance 10 s 100 s 1 s 4 Max. transient thermal impedance Z thJC=f(t p) parameter: D =t p/T 100 0.5 102 1 ms 10-1 0.2 0.1 0.05 0.02 0.01 101 DC 10 ms Z thJC [K/W] I D [A] 10 100 -2 single pulse 10-1 10 -1 10-3 10 0 10 1 10 2 10 3 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 2.1 page 4 2010-07-01 IPP048N12N3 G 5 Typ. output characteristics I D=f(V DS); T j=25 C parameter: V GS 400 10 V 7V 8V 6.5 V 6 Typ. drain-source on resistance R DS(on)=f(I D); T j=25 C parameter: V GS 15 320 12 4.5 V 6V R DS(on) [m] 240 9 5V 5.5 V I D [A] 160 5.5 V 6 6V 10 V 80 5V 3 4.5 V 0 0 1 2 3 4 5 0 0 50 100 150 V DS [V] I D [A] 7 Typ. transfer characteristics I D=f(V GS); |V DS|>2|I D|R DS(on)max parameter: T j 300 8 Typ. forward transconductance g fs=f(I D); T j=25 C 200 250 160 200 120 150 g fs [S] 80 175 C 25 C I D [A] 100 50 40 0 0 2 4 6 8 0 0 50 100 150 V GS [V] I D [A] Rev. 2.1 page 5 2010-07-01 IPP048N12N3 G 9 Drain-source on-state resistance R DS(on)=f(T j); I D=100 A; V GS=10 V 10 Typ. gate threshold voltage V GS(th)=f(T j); V GS=V DS parameter: I D 12 4 10 3.5 2300 A 3 8 230 A R DS(on) [m] 2.5 6 V GS(th) [V] 100 140 180 98 % 2 typ 4 1.5 1 2 0.5 0 -60 -20 20 60 0 -60 -20 20 60 100 140 180 T j [C] T j [C] 11 Typ. capacitances C =f(V DS); V GS=0 V; f =1 MHz 12 Forward characteristics of reverse diode I F=f(V SD) parameter: T j 105 103 104 Ciss Coss 25 C 102 175 C C [pF] 25 C, 98% 10 3 I F [A] 175 C, 98% Crss 101 102 101 0 20 40 60 80 100 0 0.5 1 1.5 2 V DS [V] V SD [V] Rev. 2.1 page 6 2010-07-01 IPP048N12N3 G 13 Avalanche characteristics I AS=f(t AV); R GS=25 parameter: T j(start) 103 14 Typ. gate charge V GS=f(Q gate); I D=100 A pulsed parameter: V DD 12 10 96 V 102 100 C 150 C 25 C 8 60V V GS [V] I AS [A] 24 V 6 101 4 2 100 100 101 t AV [s] 102 103 0 0 50 100 150 Q gate [nC] 15 Drain-source breakdown voltage V BR(DSS)=f(T j); I D=1 mA 16 Gate charge waveforms 135 V GS 130 Qg 125 V BR(DSS) [V] 120 V g s(th) 115 110 Q g(th) Q gs -60 -20 20 60 100 140 180 Q sw Q gd Q g ate 105 T j [C] Rev. 2.1 page 7 2010-07-01 IPP048N12N3 G PG-TO220-3: Outline Rev. 2.1 page 8 2010-07-01 IPP048N12N3 G Published by Infineon Technologies AG 81726 Munich, Germany (c) 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.1 page 9 2010-07-01 |
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